A technical paper titled “Flexible electronic-photonic 3D integration from ultrathin polymer chiplets” was published by researchers at Dartmouth College and Boston University.
The paper states:
“Here, we present a robust chiplet-level heterogeneous integration of polymer-based circuits (CHIP), where ultrathin polymer electronic and optoelectronic chiplets are vertically bonded at room temperature and shaped into application-specific forms with monolithic Input/Output (I/O). This process was used to develop a flexible 3D integrated optrode with high-density microelectrodes for electrical recording, micro light-emitting diodes (μLEDs) for optogenetic stimulation, temperature sensors for bio-safe operations, and shielding designs to prevent optoelectronic artifacts.”
Find the paper here. Published October 2024.
Huang, Y., Li, G., Bai, T. et al. Flexible electronic-photonic 3D integration from ultrathin polymer chiplets. npj Flex Electron 8, 61 (2024). https://doi.org/10.1038/s41528-024-00344-w
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