The steps for implementing an integrated design flow for an MCM monolithic microwave integrated circuit (MMIC) design.
Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an integrated design flow within the Cadence® AWR Design Environment® platform circuit design software for an MCM monolithic microwave integrated circuit (MMIC) design using a 2.5GHz gallium arsenide (GaAs) power amplifier (PA) along with a microwave laminate module to form the output match. This paper follows the “RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design” white paper, which examines GaAs pHEMT PA design approach from a systems perspective.
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