Everyone’s A System Designer With Heterogeneous Integration


The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by engineers at every step of the flow, from design through manufacturing. Nearly every engineer is now working or touching some technology, process, or methodology that is new. And they are inter... » read more

A Chiplet-Based Fully Homomorphic Encryption Accelerator


A technical paper titled “CiFHER: A Chiplet-Based FHE Accelerator with a Resizable Structure” was published by researchers at Seoul National University. Abstract: "Fully homomorphic encryption (FHE) is in the spotlight as a definitive solution for privacy, but the high computational overhead of FHE poses a challenge to its practical adoption. Although prior studies have attempted to desig... » read more

EDA Posts Q4 2022 Revenue of $3.9B


The ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report that the Electronic System Design (ESD) industry revenue increased 11.3% from $3.47 billion in the fourth quarter of 2021 to $3.86 billion in the fourth quarter of 2022. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 12.6... » read more

Thermal Integrity Challenges Grow In 2.5D


Thermal integrity is becoming much harder to predict accurately in 2.5D and 3D-IC, creating a cascade of issues that can affect everything from how a system behaves to reliability in the field. Over the past decade, silicon interposer technology has evolved from a simple interconnect into a critical enabler for heterogeneous integration. Interposers today may contain tens of dies or chiplets... » read more

Holistic Die-to-Die Interface Design Methodology For 2.5-D Multi-Chip-Module Systems


More than Moore technologies can be supported by system level diversification enabled by chiplet based integrated systems within multi-chip-modules (MCM) and silicon interposer based 2.5D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at system level whil... » read more

EDA Software Design Flow Considerations For The RF/Microwave Module Designer


Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an... » read more

SiPs And MCMs Broaden Opportunities For Military-Aerospace System Design


Military and aerospace (mil-aero) applications, from satellites and rockets to ships and planes, increasingly require electronic systems and subsystems with high functionality and performance in a small form factor. Meeting these demands poses higher-level challenges for packaging of these microelectronic devices, which needs to be rugged, long-lived, and affordable. Usage of multi-chip modu... » read more

Technology Advances, Shortages Seen For Wire Bonders


A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

Future Challenges For Advanced Packaging


Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

Holistic Die-to-Die Interface Design Methodology for 2.5-D Multichip-Module Systems


Abstract: "More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems. The division of large system-on-chip dies into smaller chiplets with different technology nodes specific to the chiplet application requirement enables the performance enhancement at the ... » read more

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