Career reflections with Naoya Hayashi, DNP research fellow.
Naoya Hayashi has been a friend and important contributor to the eBeam Initiative from our start over 13 years ago. We’re just one of the many interests he has embraced and championed over his 45 year career at DNP. Now it’s our turn to embrace him and thank him for the wonderful memories as he pursues his next chapter after retiring as the first research fellow from DNP this June. Aki Fujimura, co-founder of the eBeam Initiative, sat down with Hayashi-san at his local theatre La Scala in Kawagoe, Saitama, Japan, where he is a major contributor to their digital projection system. Combining Hayashi-san’s love of the theatre with his passion for the mask industry culminated in a series of unique videos for the past 14 years at the annual Photomask Japan conference.
In this video interview with Aki, you’ll hear more about the theatre, highlights from Hayashi-san’s 11 SPIE best paper awards and some entertaining stories from his early career where he learned English on a four-month stay in the US on a factory acceptance test of an eBeam mask writer that was scheduled for two weeks.
Steps are being taken to minimize problems, but they will take years to implement.
But that doesn’t mean it’s going to be mainstream anytime soon.
Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking.
New capacity planned for 2024, but production will depend on equipment availability.
L5 vehicles need at least 10 more years of development.
Increased transistor density and utilization are creating memory performance issues.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Steps are being taken to minimize problems, but they will take years to implement.
AMD CTO Mark Papermaster talks about why heterogeneous architectures will be needed to achieve improvements in PPA.
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