How proteanTecs’ monitoring system was implemented in the 5nm test chip to assist GUC in testing and characterizing the GLink PHY.
Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized interconnect solution for both CoWoS and InFO packaging technologies.
The GUC and proteanTecs collaboration started with GUC’s second generation of GLink, known as GLink 2.0. The project target was to implement the proteanTecs monitoring system into the 5nm test chip to assist GUC in testing and characterizing the GLink PHY. proteanTecs is the only company today offering comprehensive visibility into high bandwidth die-to-die interfaces based on unique, patent-protected technology.
With additional high speed, parallel die-to-die interfaces emerging, such as the UCI Express, proteanTecs intends to maintain its technology leadership and become the de-facto standard in monitoring and deep data analysis for these high-bandwidth interfaces.
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