Why and where this inspection approach is gaining traction.
Increased density in advanced node chips and advanced packaging offers a way to greatly improve performance and reduce power, but it also makes it harder to inspect these devices for real and latent defects. Higher density can lead to scattering of light, and heterogeneous integration in a package means it’s not always possible to see through all materials equally. Chris Rand, product line manager at Nordson Test & Inspection, talks about why manual X-ray inspection is becoming essential, what the tradeoffs are in different inspection approaches, and what are the tradeoffs with different inspection choices.
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