New RDL-First PoP Fan-Out Wafer-Level Package Process With Chip-to-Wafer Bonding Technology


Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has many advantages for mobile applications such as low power consumption, short signal path, small form factor, and heterogeneous integration for multifunctions. In addition, it can be applied in various package platforms, including PoP, System-in-Package (SiP), and Chip Scale Package (CSP). These advantages come from advanced inte... » read more

Momentum Builds For Advanced Packaging


The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

Understanding Advanced Packaging Technologies And Their Impact On The Next Generation Of Electronics


Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips. Advanced packaging has become integral to embedding increased functionality into a variety of electronics, such as cellular phones and self-driving vehicles, by supporting high device density in ... » read more

The Next Advanced Packages


Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Fan-Out Wafer-Level Packaging And Copper Electrodeposition


By Steven T. Mayer, Bryan Buckalew, and Kari Thorkelsson As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective way of mixing and connecting various functional technologies. One of the heterogeneous integration platforms gaining increased ac... » read more

Finding Defects In IC Packages


Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But as packaging becomes more complex, and as it is used in markets where reliability is critical, finding defects is both more difficult and more important. This has prompted the development of a ... » read more

New Trends In Wafer Bonding


Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile devices drives demand for smaller circuit footprints, but the transition isn't always straightforward. Three-dimensional integration schemes take many forms, depending on the required interconne... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

What’s The Best Advanced Packaging Option?


As traditional chip designs become more unwieldy and expensive at each node, many IC vendors are exploring or pursuing alternative approaches using advanced packaging. The problem is there are too many advanced packaging options on the table already, and the list continues to grow. Moreover, each option has several tradeoffs and challenges, and all of them are still relatively expensive. ... » read more

What’s Next In Advanced Packaging


Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

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