With SiC-optimized packaging, an XM3 module platform targets 100 kW – 300 kW applications for power density.
While silicon carbide (SiC) is still considered a relatively new material in the semiconductor market, it is now used in power circuitry that supports our everyday lifestyle — from the data centers that deliver our emails, to solar power grids that provide energy to offices and homes, to electric cars and trains we use to commute, and in factory equipment and robots that manufacture the goods we consume.
In the enterprise IT segment, SiC allows new topologies, such as the totem pole bridgeless PFC that has been limited by silicon’s (Si) inadequate performance1, to enable compliance with the Titanium standard for energy efficiency. SiC offers the solar market up to 99.5 percent efficiency, 3-times smaller size and 10-times less weight compared with Si. In an electric vehicle (EV), suitably packaged SiC modules can operate at higher ambient temperatures while delivering much lower losses. This enables anywhere from $300 to over $600 savings in battery costs, another $600 savings due to space reduction and, $500 to $1,000 savings due to less demanding thermal management.
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