Enabling New Applications With SiC IGBT And GaN HEMT For Power Module Design


The need to mitigate climate change is driving a need to electrify our infrastructure, vehicles, and appliances, which can then be charged and powered by renewable energy sources. The most visible and impactful electrification is now under way for electric vehicles (EVs). Beyond the transition to electric engines, several new features and technologies are driving the electrification of vehicles... » read more

Simplifying Power Module Verification Using Compliance Checking


By Wilfried Wessel, Siemens EDA; Simon Liebetegger, University of Applied Sciences, Darmstadt; and Florian Bauer, Siemens EDA Current simulation and verification methods for power modules are time-consuming. Each domain has specific solutions based on finite elements analysis, computational fluid dynamics and solvers for electric circuits like SPICE. This article investigates if it is possib... » read more

Why Are S-Parameters Superior For Power Module Optimization?


A power module is a high-power switching circuit – used in electric vehicles, renewable energy, photovoltaics, wind, and many more applications – that uses insulated gate bipolar transistors (IGBT) or metal-oxide-semiconductor field-effect transistors as switching elements. This paper discusses the difference in power module simulation using lumped elements and S-Parameters. Using a simple ... » read more

Integration Of S-Parameters For Power Module Verification Into The Engineers’ Design Environment


By Wilfried Wessel (Siemens EDA), Simon Liebetegger (University of Applied Sciences Darmstadt), and Florian Bauer (Siemens EDA) Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily dependent on physical prototypes. The reason for this is the unique s... » read more

How To Use S-Parameters For Power Module Verification


By Wilfried Wessel (Siemens EDA), Simon Liebetegger (University of Applied Sciences Darmstadt), and Florian Bauer (Siemens EDA) Power modules are high-power switching circuits that convert DC- in AC-currents in electric vehicles, renewable energy, and many more applications. New materials [14] and device technologies [14], such as wide bandgap semiconductors, including silicon carbide (SiC) ... » read more

How To Answer Five Common Questions About Power Module Current Density


Power module current density is an important factor in determining the efficiency and performance of power modules. This article answers five common questions about power module current density so you can make informed decisions when designing a power module for your application. 1. How many wire bonds are required? Generally, a higher current density requires an increased number of w... » read more

Power Modules: A Four-Dimensional Design Challenge Calls For A Holistic Design And Verification Approach


A power module is a high-power switching circuit used in applications for electric vehicles, renewable energy, photovoltaics, wind power, and much more. Switching-element IGBTs and MOSFETs are used in these modules. This paper discusses different technologies and the associated design challenges to achieve complex power module requirements like high voltage resistivity up to 1700 V, high curren... » read more

Smallest Thinnest Power Modules For Data Center Optical Modules


Data transmission rates in optical communication field are on a constant rise. This paper describes the ever-increasing demand for highly integrated, small form factor, low profile yet thermally superior and electrically efficient power supply solution to support these high data rates and large amount of data transfer. It then follows to highlight Renesas’s best in class mini power mo... » read more

Next Generation Chip Embedding Technology For High Efficiency Power Modules and Power SiPs


Cost, performance, and package size are some of the key drivers required in the next generation of package interconnect and package structure evolution. Embedding active die into substrates was mainly driven by package miniaturization for communication handheld devices. However, in the case of power modules, miniaturization is not the only driver that enhances the need for embedded die substrat... » read more

Wave Hello To Improved Performance


The International Energy Agency (IEA) estimated that in 2019, approximately 33 percent of all transportation-related CO2 emissions were generated by buses and light to heavy commercial vehicles. Transitioning to electric drives in this sector could clearly have a significant impact on reducing our emissions, but electrifying such demanding vehicles is not an easy task. Many of the concepts... » read more

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