SiC Chip Demand Surges


The silicon carbide (SiC) power semiconductor market is experiencing a sudden surge in demand amid growth for electric vehicles and other systems. But the demand also is causing a tight supply of SiC-based devices in the market, prompting some vendors to add fab capacity in the midst of a tricky wafer-size transition. Some SiC device makers are transitioning from 4- to 6-inch wafers in the f... » read more

The Week In Review: Manufacturing


Chipmakers and OEMs After more than four years as chief executive of GlobalFoundries, Sanjay Jha will hand over the company’s top position to Thomas Caulfield, senior vice president and general manager at the foundry vendor. Caulfield, who joined GlobalFoundries in 2014, will become CEO. He has been running the company's fab in New York. "Jha intends to work closely with the company’s shar... » read more

The Week In Review: Manufacturing


Chipmakers Who will buy Toshiba’s memory business? In the latest of what is becoming a confusing saga, Toshiba has signed a deal to sell its memory unit to a group led by Bain Capital. The Bain-led consortium will hold a 49.9% stake in the memory unit, while Toshiba will hold 40.2% and Japan’s Hoya will own 9.9%. Other members in the group include Apple, Dell, Kingston, and Seagate. In add... » read more

The Week In Review: Manufacturing


Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

The Week In Review: Manufacturing


Chipmakers Recently, Intel announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. Targeted for 7nm processes, Fab 42 will be completed in 3 to 4 years. As reported, the fab announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House. There is more to the story. Typically, Intel has two fabs for a gi... » read more

The Week In Review: Manufacturing


Chipmakers Intel has announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. The fab was announced several years ago, but Intel delayed the plant in 2014. Now, the plant, dubbed Fab 42, is moving forward again. Targeted for 7nm technology, Fab 42 will be completed in 3 to 4 years and will create approximately 3,000 jobs. The announcement was m... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design


The integration of simulation technologies, system prototyping tools, and automated test equipment is critical for addressing the complexity of developing 5G wireless technology. In these cases, design teams will need to rely on a combination of simulation and prototype testing in order to ensure design robustness. Although simulation is essential to design a test bed or prototype, measurement... » read more

Siemens To Buy Mentor For $4.5B


By Ed Sperling & Jeff Dorsch Siemens announced today that it has reached a deal to buy Mentor Graphics for $4.5 billion in cash. The move, if approved by regulators, would greatly expand Siemens' capabilities in multi-physics design and embedded software for everything from semiconductors to automotive wiring harnesses. The transaction is expected to close in the second quarter of 2017. Sie... » read more

RF GaN Gains Steam


The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

The Week In Review: Manufacturing


Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

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