tag: Qualcomm

The Week In Review: Design/IoT
By Jesse Allen - 08 May, 2015 - Comments: 0

Embedded Mentor Graphics released a new version of their Nucleus RTOS with a focus on high-performance IoT and wearable applications. Updates include support for Dynamic Linking and Loading (DLL) capabilities in Cortex-M based cores; the ability for developers to reconfigure, update, and provision connected embedded devices that utilize cloud-based remote software services; and TI WiLink 8 m... » read more

Security Progress In Some Places, Not Others
By Ed Sperling - 07 May, 2015 - Comments: 0

Security is big business, and it's increasingly part of business done between big businesses in the semiconductor market. The deal that was announced this week between NXP and Qualcomm, adding a secure NFC module to the Snapdragon chip, is certainly good business. But what's really interesting about this arrangement is that it was done between two very prominent companies, which saw a potent... » read more

Get Ready For More Biometrics
By Ernest Worthman - 07 May, 2015 - Comments: 0

Security involving scans of fingerprints, palms, faces, or some other variant has been common in movies for years, and many phones and computers now offer fingerprint scans instead of a password login. But as security risks rise with the rollout of the [getkc id="76" comment="Internet of Things"]/Internet of Everything, that technology will need to become much more pervasive and sophisticated. ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 May, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. Now, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as competitors in the fab tool market. Applied Materials held a conference call to explain the situation with TEL. Applied Materials... » read more

Problems Ahead For EDA
By Brian Bailey - 27 Apr, 2015 - Comments: 0

You may have discovered that the Semiconductor Engineering Knowledge Center (KC) provides various ways in which data can be viewed. One way is to see what events happened in a given year. During the 1990s, company activity in terms of new startups and acquisitions reached a peak, and in 1997 there were at least 29 startups that the KC contains and 25 companies acquired (let us know if there wer... » read more

What EDA’s Big 3 Think Now
By Ed Sperling - 23 Apr, 2015 - Comments: 0

In the past two months the CEOs of Cadence, Synopsys and Mentor Graphics delivered their annual high-level messages to their respective user groups. Semiconductor Engineering attended all of the speeches at these conferences, as it did in 2014 (see story here). From a high level, the big issues for CEOs last year were Moore's Law, the costs of design, the impact of low power, and business-... » read more

Pressure Builds To Revamp The Design Flow
By Ed Sperling - 23 Apr, 2015 - Comments: 1

Without [getkc id="7" kc_name="EDA"] there would be no [getkc id="74" comment="Moore's Law"] as we know it today, and without Moore's Law there would be a much more limited need for EDA. But after more than three decades of developing design flows packed with sophisticated tools to automate semiconductor design through verification, and thereby enable feature shrinks that are the basis of Moore... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Apr, 2015 - Comments: 0

It could be a long year for the equipment industry. First, Intel reduced its 2015 capital expenditure budget to $8.7 billion, plus or minus $500 million. This is down from the previous mid-point guidance of $10.1 billion. As a result of Intel’s announcement, Pacific Crest Securities cut its worldwide 2015 semiconductor CapEx forecast. The new CapEx forecast is now $62.5 billion in 2015. Th... » read more

5 Issues Under The Foundry Radar
By Mark LaPedus - 16 Apr, 2015 - Comments: 0

In the foundry business, the leading-edge segment grabs most, if not all, of the headlines. Foundry vendors, of course, are ramping up 16nm/14nm finFET processes, with 10nm and 7nm in R&D. The leading-edge foundry business is sizable, but it’s not the only thing going on in the competitive arena. In fact, there are battles taking place in many other foundry segments, such as 2.5D/3D packag... » read more

UPF 3.0 Moves Toward Ratification
By Ann Mutschler - 09 Apr, 2015 - Comments: 0

[gettech id="31044" t_name="UPF"] (Unified Power Format) 3.0 — the fourth incarnation in 10 years — is moving closer to the IEEE ballot process. Erich Marschner, verification architect at [getentity id="22017" e_name="Mentor Graphics"] and vice chair of the [gettech id="31043" comment="IEEE 1801"] working group, explained the working group is as close as possible to being on schedule for... » read more

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