tag: Qualcomm

China Foundries Seek Niches
By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus For decades, China has launched several initiatives to modernize its semiconductor industry with hopes of becoming the next IC powerhouse in Asia. In 2001, for example, China unveiled its so-called "Tenth Five-Year Plan," which called for the nation to build 25 new fabs from 2001 to 2005. At the time, the Chinese government hoped to start and fund a new crop of domestic fou... » read more

The Week In Review: Aug. 12
By Ed Sperling - 12 Aug, 2013 - Comments: 0

By Mark LaPedus Is the sky falling on semi capital spending? “We have seen several 2014 industry demand estimates in the 20%+ range, based on the ramps of FinFET and 3D NAND,” said Weston Twigg, an analyst with Pacific Crest Securities. “We expect Samsung to ramp spending in Q4, but we believe foundry and logic spending will remain soft for several quarters. As a result, we are developin... » read more

Power Shifts In Digital Chip Space
By Bhanu Kapoor - 08 Aug, 2013 - Comments: 0

By Bhanu Kapoor The power issue has been quite disrupting in the digital semiconductor space. The processor architecture shifted to parallel processing with the “power wall” stopping the frequency scaling that the industry had conveniently used in the last few decades. The power issue also is causing semiconductor process technology to change in ways other than simply scaling from one ... » read more

Mixed Signals
By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Based on the various forecasts for semiconductor equipment, the mood is mixed at this week’s Semicon West trade show in San Francisco. In its mid-year forecast, for example, SEMI predicts that the semiconductor equipment market will reach $36.3 billion in 2013, down 1.7% over 2012. But the business is expected to rebound and reach $43.98 billion in 2014, a 21.2 percent inc... » read more

Power Becomes Bigger Issue In Stacked Die
By Ed Sperling - 10 May, 2013 - Comments: 0

By Ed Sperling Concern over getting the heat out of stacked die is well defined, even if the current raft of existing and proposed solutions ranges from ineffective to exotic and expensive. What is less well understood is how to plan for and manage power inside of stacked die. While power and heat frequently go hand in hand—where there is heat there is almost always power dissipation—t... » read more

CMOS And SOI Invade RF Front End
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus The next-generation 4G wireless standard known as long-term evolution (LTE) presents some new and difficult design choices for OEMs. One of the more difficult choices involves the less glamorous, but arguably the most critical part in a handset—the radio-frequency (RF) front-end. Typically, the RF front-end often comes in a module and includes various key components, such ... » read more

Surprises Abound As Subsystem IP Gains Prominence
By The SE Staff - 28 Feb, 2013 - Comments: 0

What’s new in the world of subsystem intellectual property? To find out, System-Level Design sat down with Richard Wawrzyniak, senior market analyst for ASICs and SoCs at Semico Research Corp. What follow are excerpts of that conversation. SLD: You mentioned that the cost of semiconductor intellectual property (IP) at 20nm and below is increasing. Why is that? Wawrzyniak: The reason is c... » read more

The Week In Review: Feb. 25
By Ed Sperling - 25 Feb, 2013 - Comments: 0

By Mark LaPedus Is China set to bail out a U.S. government technology darling? Two Chinese automotive companies, Geely and Dongfeng Motor, are reported to have bid between $200 million and $350 million for a majority stake in Fisker, the maker of plug-in hybrid cars. If that happens Fisker—which has $192 million in U.S. federal government loan guarantees—could be headed to China, according... » read more

Smartphones Dial Up New RF Processes
By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus The rapid shift towards smartphones and tablets is driving the need for new and low-power chips at finer geometries. Today, the latest application processors, integrated basebands and other digital cell-phone chips are 28nm planar devices. And it won’t be long before OEMs incorporate 20nm planar and finFET devices in their systems as a means to reduce power and extend batt... » read more

Cellular Stranglehold?
By Ann Mutschler - 08 Nov, 2012 - Comments: 0

Do you ever feel like you are completely at the mercy of your cellular service provider? Yeah, me too. Not only did I have to change providers when I relocated, I had to buy a new phone of course. Since my old phone and my new phone were both iPhones, I thought for sure I could use the same car charger….but no dice. This fact has bothered me for quite some time because it made no sense to ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy