Blog Review: Oct. 16


Cadence’s Richard Goering follows Si2’s move into SPICE modeling following the acquisition of the Compact Model Council. Combining standards groups is a growing trend these days. Mentor’s Colin Walls points to the demise of reset buttons. You can always trip a circuit breaker, and usually turn off a device by pulling out the battery, but a reset button is simpler. Where did they go? ... » read more

Inside Japan: The Applied Materials-Tokyo Electron Merger


The merger of Tokyo Electron and Applied Materials has turned heads around the globe, but behind the scenes in Japan there was a recognition that this deal had to be done now or it would never be possible. Releases from both companies describe it as a merger of equals, and the Japanese press has reported it that way. But international media outside of Japan take the view that Tokyo Electron ... » read more

The Week In Review: Oct. 11


By Mark LaPedus & Ed Sperling Demand is running high for DRAMs, thanks to last month’s fab fire at Hynix’ China plant. “The impact from Hynix' fab fire seems to be far more extensive than we had originally thought. We now think the factory is most likely up at the earliest by May/June 2014, which certainly provides robust pricing support for DRAM. Hynix is in the process of convertin... » read more

The Week In Review: Oct. 4


By Mark LaPedus & Ed Sperling eSilicon introduced an automated multi-project wafer quote system, which allows companies to sort through a number of options and get pricing. The quotes are tied into TSMC's 20nm to 350nm processes, and GlobalFoundries’ 20nm to 180nm processes. The approach eliminates the need for companies to buy a full wafer if their volume requirements don’t warrant it... » read more

Blog Review: Oct. 3


Cadence’s Brian Fuller rolls out a twice-monthly TV program called “Unhinged,” which he bills as a cross between The Daily Show, Letterman and ESPN. The intro is a classic. Who needs coffee? Synopsys’ Karen Bartleson interviews Bob Metcalfe, co-inventor of Ethernet, creator of Metcalfe’s Law—which has withstood the test of time quite well—on why Ethernet still really important.... » read more

The Week In Review: Sept. 30


In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced having achieved a new world record for the conversion of sunlight into e... » read more

The Week In Review: Sept. 27


By Ed Sperling Applied Materials shook up the equipment market, announcing a deal to buy Tokyo Electron for about $9.3 billion in stock. The combination of No. 2 Applied and No. 3 TEL in that market equals a new No. 1, surpassing Dutch giant ASML in terms of revenue. Mentor Graphics rolled out a new versiion of its computational fluid dynamics product, adding Monte Carlo radiation modeling... » read more

Applied To Buy TEL


In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. Under the terms of the blockbuster deal, Applied Materials will own approximately 68% of the new company and TEL will own about 32%.  The combined entities will have a new name, dual headquarter... » read more

The Week In Review: Sept. 23


By Mark LaPedus For some time, Apple’s iPhones have incorporated a separate RF switch and diversity switch from Peregrine Semiconductor (PSMI). The switches are based on a silicon-on-insulator (SOI) variant called silicon-on-sapphire (SOS). Murata takes Peregrine’s RF switches and integrates them into a module. Doug Freedman, an analyst with RBC Capital, said Apple is no longer using PSMI�... » read more

Litho Roadmap Remains Cloudy


By Mark LaPedus For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography (NGL) technologies have forced the industry to re-write the roadmap on multiple occasions. Today, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipma... » read more

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