tag: Applied Materials

What’s After 3D NAND?
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus Planar NAND flash memory is on its last scaling legs, with 3D NAND set to become the successor to the ubiquitous 2D technology. Samsung Electronics, for one, already has begun shipping the industry’s first 3D NAND device, a 24-level, 128-gigabit chip. In addition, Micron and SK Hynix shortly will ship their respective 3D NAND devices. But the Toshiba-SanDisk duo are the lo... » read more

Front End Comes To The Back End
By Jeff Chappell - 19 Sep, 2013 - Comments: 0

By Jeff Chappell For outsourced assembly and test (OSAT) houses either planning for or already offering through-silicon via (TSV) capability for their 3D packaging efforts, this has meant the front end is coming to the back end, in a manner of speaking. A bit of an exaggeration perhaps, as most generalizations are. But thanks to TSVs, in a very real sense some of what would typically be the... » read more

The Week In Review: Sept. 16
By Mark LaPedus - 16 Sep, 2013 - Comments: 0

By Mark LaPedus In June, Crucial.com teamed up with Lou Ferrigno to invite all frustrated computer users to submit a short video showing their most fearsome, frustration-filled and computer-induced roar. Each video was evaluated according to a variety of factors, including volume, enthusiasm, perceived distress, frustration, anxiety, irritation and overall hopelessness. The memory module suppl... » read more

Blog Review: Sept. 11
By Ed Sperling - 11 Sep, 2013 - Comments: 0

By Ed Sperling Synopsys’ Eric Huang has unearthed the weirdest USB video ever produced—a dancing USB lighter. The messaging is pretty bizarre, too. Cadence’s Brian Fuller takes a whirlwind tour of the engineering accomplishments for the week. Check out the T-shirt message. Clearly they’re not talking about semiconductor engineers. Mentor’s Colin Walls looks at the Lua scripting... » read more

Materials Innovation Key To Enabling Next-Generation Mobile Devices
By Kathryn Ta - 09 Sep, 2013 - Comments: 0

By Kathryn Ta There’s a lot of excitement building regarding several new mobile product announcements on the horizon, including a concept smartwatch, a new phablet and a new smartphone. These products are sure to be on a lot of consumers’ wish lists this holiday season, and users will expect them to have a sleeker look and feel, while running applications instantly, providing all-day batte... » read more

The Week In Review: Sept. 9
By Mark LaPedus - 09 Sep, 2013 - Comments: 0

By Mark LaPedus SK Hynix’ DRAM fab in China caught on fire. The fire caused one minor injury, but it did not impact the equipment, according to reports. SK Hynix will re-open the fab soon, according to reports. Bob Halliday, Applied Materials’ CFO, gave a presentation at an analyst event, saying: “I think there’s probably more technology inflections going on right now than in years.... » read more

The Week In Review: Aug. 26
By Mark LaPedus - 26 Aug, 2013 - Comments: 0

By Mark LaPedus The evolving relationship between humans and machines is the key theme of Gartner’s most "hyped” technologies in 2013. Gartner has chosen to feature the relationship between humans and machines due to the increased hype around smart machines, cognitive computing and the Internet of Things. Gartner also released its updated chart of hyped technologies. SunEdison, formerly... » read more

The Week In Review: Aug. 19
By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

The Week In Review: Aug. 16
By Ed Sperling - 16 Aug, 2013 - Comments: 0

By Ed Sperling Manufacturing Equipment giant Applied Materials added three extra letters company president Gary Dickerson’s title—CEO. Mike Splinter, who has served as the company’s CEO since 2003, will become executive chairman of the board of directors. Dickerson was the CEO of Varian, which Applied Materials acquired in 2011. Synopsys introduced a Dolby decoder for its ARC process... » read more

What Is Going On With Sub-20nm Flash?
By Gill Lee - 15 Aug, 2013 - Comments: 0

By Gill Lee This week I’ll be participating in a panel discussion at the Flash Memory Summit in Santa Clara, CA. The panel’s topic, Flash Below 20nm: What is Coming and When?, couldn’t be more timely. Particularly in light of a leading NAND manufacturer’s recent announcement that they will begin mass production of the semiconductor industry’s first 3D vertical NAND flash memory later... » read more

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