The Evolving Interconnect

By Ann Mutschler - 28 Mar, 2013 - Comments: 0

By Ann Steffora Mutschler Chip interconnect protocol requirements are evolving as designs move to 20nm and below process geometries, and not always in predictable ways. At least part of this is being driven by what an SoC is used for. The continued push to shrink features opens up real estate at each new process node. For the past decade, that real estate has been used to add more featu... » read more

What’s In A Name?

By Subi Kengeri - 20 Mar, 2013 - Comments: 0

By Subi Kengeri Consumers continue to demand smaller, faster and more energy-efficient electronic devices, driving the semiconductor industry to accelerate development of commercially viable chips on more advanced nodes. However, these new nodes don’t just appear by magic. It takes a great deal of careful planning to develop and deliver a process technology platform that offers competitivene... » read more

Good Pattern Flow Ahead For 14, 10nm

By Ann Mutschler - 21 Feb, 2013 - Comments: 0

By Ann Steffora Mutschler Given complexity, yield, power and other challenges with leading edge manufacturing, semiconductor foundries increasingly have been forced to require more and more restrictive design rules with each new process node. “They keep adding more design rules and more operations to a particular check to eliminate corner cases where in manufacturing they saw some variant... » read more

Accelerating Moore’s Law

By Ed Sperling - 21 Feb, 2013 - Comments: 0

By Ed Sperling Ever since the inception of Moore’s Law, process nodes have moved forward at a rate of once every 18 to 24 months. Companies have been talking about slowing down the rate of progression as things get harder, but at least for the next couple of process nodes something very strange will occur—Moore’s Law will accelerate. The root cause is growing competition for a shrinki... » read more

FinFETs, EUV And Moore’s Law

By Ed Sperling - 21 Feb, 2013 - Comments: 0

GlobalFoundries VP Subramani Kengeri talks about progress and problems with advanced processes with Semiconductor Manufacturing & Design. [youtube vid=_Ang0I1vWdI] » read more

SOI Highlights at Common Platform Tech Forum

By Various Writers - 19 Feb, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ The 2013 Common Platform Technology Forum showcased “the latest technological advances being delivered to the world’s leading electronics companies,” so of course SOI-based topics were well-represented. Happily, those of us who weren’t able to get over to Silicon Valley were able to attend “virtually” via a ... » read more

Sprint To The Finish Line

By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss future challenges, pain points, and how the supply chain is being reconfigured with Chi-Ping Hsu, senior vice president for R&D in the Silicon Realization Group at Cadence. What follows are excerpts of that conversation. LPHP: Has the move to 20nm processes with 14nm finFETs progressed as smoothly as everyone hop... » read more

Tech Talk: Getting To The Next Node

By Ed Sperling - 14 Feb, 2013 - Comments: 0

IBM's Gary Patton talks with Low-Power/High-Performance Engineering about finFETs, EUV, and the challenges of staying on the Moore's Law road map. [youtube vid=jtz9XSXyBp0] » read more

ST-Ericsson 28nm FD-SOI/ARM Chip Hits 2.8GHz at CES

By Various Writers - 22 Jan, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ What a great start to 2013: at CES in Las Vegas, ST-Ericsson announced the NovaThor™ L8580 ModAp, “the world’s fastest and lowest-power integrated LTE smartphone platform.” This is the one that’s on STMicroelectronics’ 28nm FD-SOI, with sampling set for Q1 2013. And it’s a game changer – for users, fo... » read more

First Silicon At 14nm

By Ed Sperling - 17 Jan, 2013 - Comments: 0

By Ed Sperling The first 14nm test chips are beginning to roll out the door from foundries, and companies are beginning to trumpet their success. But before anyone pops the champagne corks, there are some caveats. First of all, what most people are billing as 14nm chips are actually mostly 20nm. They are readily willing to concede that point, settling on 16nm, but the reality is that it’s... » read more

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