tag: 2.5D packaging

Probing Attacks Against Chiplets
By Technical Paper Link - 11 Jun, 2024 - Comments: 0

A technical paper titled “Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques” was published by researchers at University of Massachusetts and Worcester Polytechnic Institute. Abstract: "Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Multi-Die Packaging And Thermal Superposition Modeling
By eSilicon - 25 Apr, 2018 - Comments: 0

Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets. Considerations such as thermal performance and mechanical reliability are equally important but tend to be addressed later in the design cycle. Presented in this paper is a historical view of the packaging trends leading to the current multi-di... » read more

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