Shortages Hit Packaging Biz


Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

The 200mm Equipment Scramble


An explosion in 200mm demand has set off a frenzied search for used semiconductor manufacturing equipment that can be used at older process nodes. The problem is there is not enough used equipment available, and not all of the new or expanding 200mm fabs can afford to pay the premium for refurbished or new equipment. This may sound like a straightforward supply and demand issue, but behind t... » read more

Funding China’s 200mm Fabs


China’s ambitious plans to build a world-class semiconductor manufacturing supply chain domestically certainly has the industry’s attention. With over a dozen new 300mm fab announcements lately from Foundries, DRAM, 3D NAND, and as well as CMOS image sensor companies (either from international semiconductor makers or from indigenous players), China has launched a huge investment in wafer fa... » read more

Sourcing Used Equipment


Emerald Greig, executive vice president for the Americas & Europe at SurplusGlobal, sat down to discuss fabs and the used/refurbished equipment market with Semiconductor Engineering. SurplusGlobal is one of the world’s largest suppliers of secondary fab equipment. What follows are excerpts of that conversation. SE: What is the status of the 200mm new or used equipment market today? ... » read more

Will Higher Production Costs Hamper IoT Growth?


No question, 2017 is expected to be a good year for the semiconductor industry. Semiconductor revenues for 2017 are expected to increase more than 9% this year. A 6% increase in unit sales, as well as higher average selling prices for memory products, will help drive the revenue growth rate to its highest level since 2010. Wafer demand is forecast to grow by almost 8%. The higher revenue growth... » read more

200mm Crisis?


Over the last year or so, the IC industry has experienced an acute shortage of both 200mm fab capacity and 200mm equipment amid a surge of demand for certain chips. Right now, though, the 200mm shortfall is much worse than before. But this situation isn’t expected to improve for both elements in the second half of 2017, and perhaps beyond. On the capacity front, chipmakers are generally... » read more

Fab Tool Biz Faces Challenges In 2017


After experiencing a gradual recovery and positive growth in 2016, the semiconductor equipment industry sees a mixed picture as well as some uncertainty in 2017. In the near term, though, business is robust. Several chipmakers started to place a sizeable number of fab tool orders in the latter part of 2016, particularly in three areas—3D NAND, logic and foundry. Now, after buying the in... » read more

Watch Out For 200mm Fabs: Fab Outlook To 2020


One year after the debut of the industry’s first 200mm Fab Outlook report, SEMI has just issued an October 2016 update with the improved and expanded report forecasting 200mm fab trends out to 2020. This extensive report features trends from 2009 to 2020, showing how 200mm fab activities and capacity change worldwide.  Industry spending for construction and equipment is detailed and analy... » read more

Mask Maker Worries Grow


Photomasks are becoming more complex and expensive at each node, thereby creating a number of challenges on several fronts. For one thing, the features on the [getkc id="265" kc_name="photomask"] are becoming smaller and more complex at each node. Second, the number of masks per mask-set are increasing as a result of multiple patterning. Third, it costs more to build and equip a new mask fab... » read more

5 Takeaways From Semicon


As usual, the recent Semicon West trade show was a busy, if not an overwhelming, event. The event, which took place in San Francisco in early July, featured presentations on the usual subjects in the semiconductor and IC-equipment sectors. There were sessions on 200mm, next-generation processes, transistors, lithography, MEMS and many others. In no particular order, here are my five ta... » read more

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