Manufacturing Bits: March 22

By Mark LaPedus - 22 Mar, 2016 - Comments: 0

Tunable windows Harvard University has put a new twist on tunable windows. Researchers have devised a new manufacturing technique that can change the opacity of a window. With the flip of a switch, the window can become cloudy, clear or somewhere in the middle. Tunable windows, which aren’t new, rely on electrochemical reactions. Typically, the glass is coated with materials using vacuum... » read more

The Bumpy Road To 10nm FinFETs

By Mark LaPedus - 21 May, 2015 - Comments: 0

Foundry vendors are currently ramping up their 16nm/14nm [getkc id="185" kc_name="finFET"] processes in the market. Vendors are battling each other for business in the arena, although the migration from planar to finFETs is expected to be a slow and expensive process. Still, despite the challenges at 16nm/14nm, vendors are gearing up for the next battle in the foundry business—the 10nm nod... » read more

Manufacturing Bits: April 14

By Mark LaPedus - 14 Apr, 2015 - Comments: 0

Monster waves of light The FOM Institute AMOLF has observed what researchers call monster waves of light. In this phenomenon, monster waves of light appear from nowhere and then disappear again. Researchers have shown that it is possible to influence the probability of this phenomenon. As a result, the technology could lead to faster telecommunication systems or more sensitive sensors, acco... » read more

Manufacturing Bits: Feb. 10

By Mark LaPedus - 10 Feb, 2015 - Comments: 0

Deadweight machines The National Institute of Standards and Technology (NIST) is in the process of cleaning, restoring and recalibrating its 4.45-million Newton deadweight machine. NIST’s deadweight machine, the largest of its kind in the world, is equivalent to one million pounds-force. Built in 1965, the deadweight system consists of a stack of 20 stainless steel discs about three meter... » read more

Manufacturing Bits: Jan. 13

By Mark LaPedus - 13 Jan, 2015 - Comments: 0

Pop-up 3D printing Northwestern University and the University of Illinois at Urbana-Champaign have developed a new “pop-up” printing technique to make 3D structures down to 100nm. The technique has advantages over today’s 3D printing, which is creating a lot of buzz, if not hype, in the market. Researchers from Northwestern and Illinois devised a printing technique that mimics the act... » read more

Manufacturing Bits: Jan. 6

By Mark LaPedus - 06 Jan, 2015 - Comments: 1

Vertical SiC chips for electric cars Silicon carbide (SiC) is a promising material for power electronics. The material has a high breakdown voltage, high operating temperatures and a superior thermal conductivity. At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, Toyota, the National Institute of Advanced Industrial Science and Technology (AIST) and the... » read more

Manufacturing Bits: Dec. 30

By Mark LaPedus - 30 Dec, 2014 - Comments: 0

Mechanical switches For years, the industry has been talking about the use of advanced mechanical switches in low-power applications. In theory, mechanical switches have zero off-state leakages, abrupt ON/OFF switching capabilities and small voltage swings. Mechanical switches could overcome the energy efficiency limit of CMOS. In fact, mechanical switches could replace CMOS in some applica... » read more

Manufacturing Bits: Sept. 9

By Mark LaPedus - 09 Sep, 2014 - Comments: 0

Whispering sensors Inspired by a whispering technology from a famous cathedral, Washington University in St. Louis and Tsinghua University in China have developed a new sensor that can detect and count nanoparticles down to 10nm and perhaps below. Researchers have devised a Raman microlaser sensor in a silicon dioxide chip. The microsensor is called a whispering gallery mode resonator (WGMR... » read more

Manufacturing Bits: July 22

By Mark LaPedus - 22 Jul, 2014 - Comments: 0

Skateboarding on 2D materials Two-dimensional materials are gaining steam in the R&D labs. The 2D materials include graphene, boron nitride (BN) and the transition-metal dichalcogenides (TMDs). These materials are attractive candidates for futuristic field-effect transistors (FETs). But researchers must gain more insight into these materials in order to understand their properties. For ... » read more

Manufacturing Bits: April 29

By Mark LaPedus - 29 Apr, 2014 - Comments: 0

Silky e-beam lithography Tufts University has put a soft and silky spin on direct-write electron-beam lithography. Researchers used common silk as the resist material, enabling the production of photonic lattices, quantum dots and other structures. This approach is a green alternative to traditional and toxic resists. The silk-based resist is developed using a water-based process. It starts... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?