tag: 2D

Better Choreography Required For Complex Chips
By Karen Heyman - 22 Jun, 2023 - Comments: 0

The rapidly growing number of features and options in chip design are forcing engineering teams to ratchet up their planning around who does what, when it gets done, and how various components will interact. In effect, more elements in the design flow need to be choreographed much more precisely. Some steps have to shift further left, while others need to be considered earlier in the plannin... » read more

van der Waals Semiconductor Empowered Vertical Color Sensor
By Technical Paper Link - 20 Apr, 2022 - Comments: 0

Abstract "Biomimetic artificial vision is receiving significant attention nowadays, particularly for the development of neuromorphic electronic devices, artificial intelligence, and microrobotics. Nevertheless, color recognition, the most critical vision function, is missed in the current research due to the difficulty of downscaling of the prevailing color sensing devices. Conventional colo... » read more

The development of integrated circuits based on two-dimensional materials
By Technical Paper Link - 23 Nov, 2021 - Comments: 0

Abstract Two-dimensional (2D) materials could potentially be used to develop advanced monolithic integrated circuits. However, despite impressive demonstrations of single devices and simple circuits—in some cases with performance superior to those of silicon-based circuits—reports on the fabrication of integrated circuits using 2D materials are limited and the creation of large-scale circu... » read more

Why Wafer Bumps Are Suddenly So Important
By Anne Meixner - 10 Aug, 2021 - Comments: 2

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing measurement technologies. Bump co-planarity is essentially a measure of flatness. Specifically, it measures the variation in bump height, which may have a target, for example, of about 100 microns. As a ... » read more

Confusion Grows Over Packaging And Scaling
By Ann Mutschler - 15 Oct, 2020 - Comments: 0

The push toward both multi-chip packaging and continued scaling of digital logic is creating confusion about how to classify designs, what design tools work best, and how to best improve productivity and meet design objectives. While the goals of design teams remains the same — better performance, lower power, lower cost — the choices often involve tradeoffs between design budgets and ho... » read more

New Packaging Roadmap
By Katherine Derbyshire - 17 Dec, 2019 - Comments: 3

Historically, the electronics industry has drawn sharp distinctions between the integrated circuit chip, the package that protects it from the environment, and the board that connects it to other devices in a complete system. The circuit and systems worlds have been largely isolated from each other, using different tools, different processes, and different metrics for success. While integrated ... » read more

What’s A Mott FET?
By Katherine Derbyshire - 17 Dec, 2018 - Comments: 0

The unique physics of two-dimensional semiconductors offers the potential for new kinds of switches that could extend the usefulness of conventional MOSFETs into a variety of new areas. A MOSFET applies a voltage to one side of the gate capacitor. The resulting electric field in the channel shifts the band structure and facilitates or impedes the flow of carriers. So as devices shrink, the g... » read more

Next EUV Issue: Mask 3D Effects
By Mark LaPedus - 25 Apr, 2018 - Comments: 6

As extreme ultraviolet (EUV) lithography moves closer to production, the industry is paying more attention to a problematic phenomenon called mask 3D effects. Mask 3D effects involve the photomask for EUV. In simple terms, a chipmaker designs an IC, which is translated from a file format into a photomask. The mask is a master template for a given IC design. It is placed in a lithography scan... » read more

Manufacturing Bits: June 21
By Mark LaPedus - 21 Jun, 2016 - Comments: 0

Atomic sculpting Oak Ridge National Laboratory has combined a scanning transmission electron microscope (STEM) with new electronic controls. This tool enables the construction, or the atomic sculpting, of 3D-like feature sizes down to 1nm and 2nm. To achieve these dimensions, the STEM is controlled with a special set of programmable electronics. This, in turn, enables the STEM to tunnel in... » read more

Manufacturing Bits: March 22
By Mark LaPedus - 22 Mar, 2016 - Comments: 0

Tunable windows Harvard University has put a new twist on tunable windows. Researchers have devised a new manufacturing technique that can change the opacity of a window. With the flip of a switch, the window can become cloudy, clear or somewhere in the middle. Tunable windows, which aren’t new, rely on electrochemical reactions. Typically, the glass is coated with materials using vacuum... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy