tag: 5nm

Simplifying And Speeding Up Verification
By Ed Sperling - 16 Jun, 2020 - Comments: 1

Semiconductor Engineering sat down to discuss what's ahead for verification with Daniel Schostak, Arm fellow and verification architect; Ty Garibay, vice president of hardware engineering at Mythic; Balachandran Rajendran, CTO at Dell EMC; Saad Godil, director of applied deep learning research at Nvidia; Nasr Ullah, senior director of performance architecture at SiFive. What follows are excerpt... » read more

How To Improve DPPM By 10X Without Affecting Yield
By Shai Eisen - 15 Jun, 2020 - Comments: 0

Chips today are under immense pressure. With wider process variation manifested at wafer and die levels in single-digit nodes, highly complex designs, and effects of application and system integration, it’s no wonder the electronics value chain is becoming ever more reliant on expensive guard-bands. The ecosystem is not yet equipped to find all existing defects during test. So while quality e... » read more

Aging Problems At 5nm And Below
By Brian Bailey - 11 Jun, 2020 - Comments: 3

The mechanisms that cause aging in semiconductors have been known for a long time, but the concept did not concern most people because the expected lifetime of parts was far longer than their intended deployment in the field. In a short period of time, all of that has changed. As device geometries have become smaller, the issue has become more significant. At 5nm, it becomes an essential par... » read more

High-Speed SerDes At 7/5nm
By Ed Sperling - 02 Jun, 2020 - Comments: 0

Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how to optimize PHYs for integration on all four corners of an SoC, as well as the PPA implications of moving large amounts of data across and around a chip. » read more

Ensuring HBM Reliability
By Ed Sperling - 27 May, 2020 - Comments: 0

Igor Elkanovich, CTO of GUC, and Evelyn Landman, CTO of proteanTecs, talk with Semiconductor Engineering about difficulties that crop up in advanced packaging, what’s redundant and what is not when using high-bandwidth memory, and how continuous in-circuit monitoring can identify potential problems before they happen. » read more

Yield And Reliability Challenges At 7nm And Below
By PDF Solutions - 26 May, 2020 - Comments: 0

Layout Design Rules have been scaled very aggressively to enable the 7nm technology node without EUV. As a result, achieving acceptable performance and yield in High Volume Manufacturing (HVM) has become an extremely challenging task. Systematic yield and parametric variabilities have become quite significant. Moreover, due to overlay tolerance requirements and diminishing process windows, reli... » read more

Challenges In Stacking, Shrinking And Inspecting Next-Gen Chips
By Ed Sperling and Mark LaPedus - 21 May, 2020 - Comments: 0

Rick Gottscho, CTO of Lam Research, sat down with Semiconductor Engineering to discuss memory and equipment scaling, new market demands, and changes in manufacturing being driven by cost, new technologies, and the application of machine learning. What follows are excerpts of that conversation. SE: We have a lot of different memory technologies coming to market. What's the impact of that? ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 May, 2020 - Comments: 0

Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000 wafers per month. TSMC’s total spending on this project will be approximately $12 billion from 2021 to 2029. Construction is planned to start in 2021 with production targeted to begin in 202... » read more

New Uses For Manufacturing Data
By Ed Sperling - 12 May, 2020 - Comments: 0

The semiconductor industry is becoming more reliant on data analytics to ensure that a chip will work as expected over its projected lifetime, but that data is frequently inconsistent or incomplete, and some of the most useful data is being hoarded by companies for competitive reasons. The volume of data is rising at each new process node, where there are simply more things to keep track of,... » read more

An Inside Look At Testing’s Leading Edge
By Ed Sperling - 12 May, 2020 - Comments: 0

Mike Slessor, president and CEO of FormFactor, sat down with Semiconductor Engineering to discuss testing of AI and 5G chips, and why getting power into a chip for testing is becoming more difficult at each new node. SE: How does test change with AI chips, where you've got massive numbers of accelerators and processors developed at 7 and 5nm? Slessor: A lot of the AI stuff that we've been... » read more

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