tag: 6nm

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Apr, 2020 - Comments: 0

Chipmakers TSMC posted mixed results for the quarter, although there was a capital spending surprise. “It maintained its 2020 capex at $15B-$16B despite smartphone softness, primarily to support a strong 5nm ramp, led by demand from 5G and HPC customers,” said Weston Twigg, an analyst at KeyBanc, in a research note. “Despite lowering its industry outlook, TSMC still expects to grow its o... » read more

Mask Making Issues With EUV
By Mark LaPedus - 17 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask trends with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Thomas Scheruebl, director of strategic business development and product strategy at Zeiss; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What fol... » read more

5nm Vs. 3nm
By Mark LaPedus - 24 Jun, 2019 - Comments: 16

Foundry vendors are readying the next wave of advanced processes, but their customers will face a myriad of confusing options—including whether to develop chips at 5nm, wait until 3nm, or opt for something in between. The path to 5nm is well-defined compared with 3nm. After that, the landscape becomes more convoluted because foundries are adding half-node processes to the mix, such as 6nm ... » read more

IP Requires System Context At 6/5/3nm
By Ann Mutschler - 01 May, 2019 - Comments: 0

Driven by each successive generation of semiconductor manufacturing technology, complexity has reached dizzying levels. Every part of the design, verification and manufacturing is more complicated and intense the more transistors are able to be packed onto a die. For these reasons, the entire system must be taken into consideration as a whole – not just as individual building blocks as could ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Apr, 2019 - Comments: 0

Fab tools and test Lam Research has developed a new self-maintaining or self-cleaning chamber for its etch tools. With the technology, Lam announced a new industry benchmark has been set for productivity in etch processing using its self-maintaining equipment. Etch process modules are typically cleaned weekly or monthly. Recently, Lam and a chipmaker reached the milestone of going 365 days... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Apr, 2019 - Comments: 0

Chipmakers Here comes the battle between 5nm and 6nm processes at two foundry vendors—Samsung and TSMC. Meanwhile, Intel is behind and scrambling to get 10nm out the door. (Intel's 10nm is equivalent to 7nm from the foundries.) Last week, TSMC announced delivery of a complete version of its 5nm design infrastructure. TSMC’s 5nm technology is based on a finFET. This week, Samsung anno... » read more

The Materials Gap
By Ed Sperling - 21 Sep, 2017 - Comments: 0

When consolidation thinned the ranks of semiconductor foundries and equipment makers, materials companies figured things were about to get better. They haven't. There are a couple of reasons for this. First, semiconductors are now so complex and difficult to develop that a slew of innovations are required on all sides. Everyone is familiar with transistor structures, interconnects and lithog... » read more

Node Warfare?
By Mark LaPedus - 20 Sep, 2017 - Comments: 6

By Mark LaPedus & Ed Sperling GlobalFoundries uncorked a 12nm finFET process, which the company said will provide a 15% increase in density and more than 10% improvement in performance over the foundry's existing 14nm process. This is GlobalFoundries' second 12nm process. It announced a 12nm FD-SOI process called 12FDX last September, although it first mentioned a 12nm process back in J... » read more

2.5D, ASICs Extend to 7nm
By Mark LaPedus - 13 Jun, 2017 - Comments: 2

The leading-edge foundry market is heating up. For example, GlobalFoundries, Intel, Samsung and TSMC have recently announced their new and respective processes. The new processes from vendors range anywhere from 10nm to 4nm, although the current battle is taking place at 10nm and/or 7nm. In fact, one vendor, GlobalFoundries, this week will describe more details about its previously-announced... » read more

Samsung Unveils Scaling, Packaging Roadmaps
By Ed Sperling - 24 May, 2017 - Comments: 5

Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

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