tag: 7nm

Security Issues Up With Heterogeneity
By Ann Mutschler - 05 Jun, 2017 - Comments: 0

The race toward heterogeneous designs is raising new security concerns across the semiconductor supply chain. There is more IP to track, more potential for unexpected interactions, and many more ways to steal data or IP. Security is a difficult problem no matter what kind of chip is involved, and it has been getting worse as more devices, machines and systems are connected to the Internet. B... » read more

Foundry Wars, Take Two
By Ed Sperling - 25 May, 2017 - Comments: 0

Samsung, GlobalFoundries, TSMC and Intel all have declared their intention to fill in nearly every node possible with multiple processes, different packaging options, and new materials. In fact, the only number that hasn't been taken so far is 9nm. It's not that one foundry's 10nm is the same as another's. Each company defines its nodes differently, and these days comparing nodes is almost m... » read more

Samsung Unveils Scaling, Packaging Roadmaps
By Ed Sperling - 24 May, 2017 - Comments: 5

Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

Reworking Established Nodes
By Ed Sperling - 24 May, 2017 - Comments: 2

New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void. As with all electronic devices, the focus is on cost-cutting. But because these markets are likely ... » read more

The Race To 10/7nm
By Mark LaPedus - 22 May, 2017 - Comments: 4

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

North America Equipment Market Rebounds
By Lara Chamness - 18 May, 2017 - Comments: 0

Coming off of two consecutive down years, the North America semiconductor fab equipment market is set to experience growth this year and into 2018. The market is primarily being driven by investments from Samsung, Intel, GlobalFoundries, and Micron, which are expected to account for 85 percent of fab equipment purchased in the region this year. These fab equipment purchases are targeted ... » read more

Power Just One Piece Of The Puzzle At 10nm And Below
By Ann Mutschler - 11 May, 2017 - Comments: 0

With dynamic power density and rising leakage power becoming more problematic at each new node, it is more important than ever to look at designs today with power in mind from the very start. As part of this complex picture of electronic design today, every piece in the design flow must tie together for the greatest efficiency and optimization. While this is partly power, there are more... » read more

Power Challenges At 10nm And Below
By Ann Mutschler - 11 May, 2017 - Comments: 1

Current density is becoming much more problematic at 10nm and beyond, increasing the amount of power management that needs to be incorporated into each chip and boosting both design costs and time to market. Current per unit of area has been rising since 90nm, forcing design teams to leverage a number of power-related strategies such as [getkc id="143" kc_name="dynamic voltage and frequency... » read more

Intel Inside The Package
By Ed Sperling - 08 May, 2017 - Comments: 1

Mark Bohr, senior fellow and director of process architecture and integration at Intel, sat down with Semiconductor Engineering to discuss the growing importance of multi-chip integration in a package, the growing emphasis on heterogeneity, and what to expect at 7nm and 5nm. What follows are excerpts of that interview. SE: There’s a move toward more heterogeneity in designs. Intel clearly ... » read more

Design For Silicon Success At 7nm
By Annapoorna Krishnaswamy - 01 May, 2017 - Comments: 0

Next-generation automotive, mobile and high-performance computing applications demand the use of 7nm SoCs to deliver greater functionality and higher performance at much lower power. According to Gartner, when compared to 16nm/14nm technology, 7nm offers 35% speed improvement, 65% less power, and 3.3X density improvement. Hence, despite a whopping cost of $271M — per Gartner's estimate — to... » read more

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