Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 10 Apr, 2020 - Comments: 0

COVID-19/Medical Mentor's parent company Siemens is making its Additive Manufacturing (AM) Network, along with its 3D printers, available to the global medical community. MEMS is at the forefront of SARS-CoV-2 testing, writes Alissa M. Fitzgerald, founder of AMFitzgerald in a blog on SEMI.org. Fitzgerald points out a MEMS silicon PCR chip, developed by Northrup et. al. at Lawrence Livermore... » read more

Top Tech Talks Of 2018

By Linda Christensen - 31 Dec, 2018 - Comments: 0

2018 shaped up to be a year of transition and inflection, sometimes in the same design. There were new opportunities in automotive, continued difficulties in scaling, and an explosion in AI and machine learning everywhere. Traffic numbers on stories give a snapshot of the most current trends, but with videos those trends are even more apparent because of the time invested in watching those v... » read more

Cracking The Auto IC Market

By Ann Mutschler - 06 Sep, 2018 - Comments: 0

The market for automotive electronics is booming, and it has set off a global scramble among established chipmakers and startups. What's becoming clear, though, is that not everyone understands just how different automotive is from the mobile market. Mobile is still the highest-volume market for semiconductors, but the growth has flattened. In contrast, the value of the automotive electronic... » read more

802.11ax: Faster Wireless

By Ed Sperling - 27 Aug, 2018 - Comments: 0

Marvell's Sathya Subramanian talks with Semiconductor Engineering about the new 802.11ax wireless standard, how it will work with 5G and existing networks, and how to set up an integrated solution to reduce bottlenecks in the home and in the enterprise. https://youtu.be/KZP59qw6j4Y » read more

Connecting Cars Reliably

By Avinash Ghirnikar - 07 Jun, 2018 - Comments: 0

Imagine motoring along through busy, urban traffic in your new connected car that is learning, getting smarter, safer and more reliable as it is driving. Such a car is constantly gathering and generating all kinds of data that is intermittently and opportunistically being uploaded to the cloud. As more cars on the road feature advanced wireless connectivity, this exciting future will become com... » read more

Challenges At The Edge

By Kevin Fogarty - 03 May, 2018 - Comments: 0

By Kevin Fogarty and Ed Sperling Edge computing is inching toward the mainstream as the tech industry begins grappling with the fact that far too much data will be generated by sensors to send everything back to the cloud for processing. The initial idea behind the IoT/IIoT, as well as other connected devices, was that simple sensors would relay raw data to the cloud for processing throug... » read more

The Week In Review: Design

By Jesse Allen - 23 Feb, 2018 - Comments: 0

Tools & IP Pro Design launched three new proFPGA Zynq UltraScale+ FPGA modules for SoC and IP prototyping. The modules combine FPGA logic with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors and on-board interfaces. The modules offer a total of up to 5 extension sites with 531 standard I/Os and 16 multi-gigabit transceivers (MGTs). The board allows a maximum point-to-point ... » read more

Tech Talk: 802.11ax Multi-User

By Ed Sperling - 12 Dec, 2017 - Comments: 0

Daniel Webb, staff marketing manager at Marvell, talks about the new wireless standard, what's needed to make it work, and why it's so critical in the home and office. https://youtu.be/xIG7J928XFs » read more

The Insatiable Need For Bandwidth

By Nick Ilyadis - 06 Jul, 2017 - Comments: 0

With the push for more and more Wi-Fi bandwidth, the WLAN industry, its standards committees, and the Ethernet switch manufacturers are having a hard time keeping up with the need for more speed. As the industry prepares for upgrading to 802.11ac Wave 2 and the promise of 11ax, the ability of Ethernet over existing copper wiring to meet the increased transfer speeds is being challenged. And wha... » read more

Wireless Test: Too Many Protocols

By Jeff Dorsch - 08 May, 2017 - Comments: 0

Testing wireless communications is getting far more difficult as more markets begin adding wireless communications and standards groups push to improve the speed, power and security of existing protocols. There is already a long list of protocols, and it's growing further as new communications technologies are added into the mix. With the addition of 5G, the new 802.11ax standard, and other ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?