tag: AMD

Spreading Out The Cost At 3nm
By Ed Sperling - 18 Jun, 2020 - Comments: 5

The current model for semiconductor scaling doesn't add up. While it's possible that markets will consolidate around a few basic designs, the likelihood is that no single SoC will sell in enough volume to compensate for the increased cost of design, equipment, mask sets and significantly more testing and inspection. In fact, even with slew of derivative chips, it may not be enough to tip the ec... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 12 Jun, 2020 - Comments: 0

Edge, cloud, data center Programmable logic company Efinix used Cadence’s Digital Full Flow to finish Efinix’s Trion FPGA family for edge computing, AI/ML and vision processing applications, according to a press release. Last week Efinix also announced three software defined SoCs based on the RISC-V core. The SoCs are optimized to the Trion FPGAs. AI, machine learning Amazon will tempo... » read more

Fundamental Changes In Economics Of Chip Security
By Ed Sperling - 10 Jun, 2020 - Comments: 0

Protecting chips from cyberattacks is becoming more difficult, more expensive and much more resource-intensive, but it also is becoming increasingly necessary as some of those chips end up in mission-critical servers and in safety-critical applications such as automotive. Security has been on the semiconductor industry's radar for at least the past several years, despite spotty progress and ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 Jun, 2020 - Comments: 0

Edge, cloud, data center Synopsys launched its USB4 IP and tools, already with a successful tapeout of a USB4 PHY test chip on 5nm advanced FinFET process. The Designware USB4 IP’s throughput is up to 20 or 40 Gbps, which Synopsys says is the bandwidth needed for high-performance edge AI, storage, PC, and tablet SoC designs. Also, Samsung Foundry certified Synopsys’ Design Compiler NXT for ... » read more

Designing The Next Big Things
By Ed Sperling - 05 Jun, 2020 - Comments: 0

The edge is a humongous opportunity for the semiconductor industry. The problem, despite its name, is that it's not a single thing. It will be comprised of thousands of different chips and systems, and very few will be sold in large volumes. The edge is the culmination of decades of improvement in power and performance, coupled with the architectural creativity that has exploded since the bene... » read more

The Good And Bad Of Chiplets
By Mark LaPedus - 27 May, 2020 - Comments: 1

The chiplet model continues to gain traction in the market, but there are still some challenges to enable broader support for the technology. AMD, Intel, TSMC, Marvell and a few others have developed or demonstrated devices using chiplets, which is an alternative way to develop an advanced design. Beyond that, however, the adoption of chiplets is limited in the industry due to ecosystem issu... » read more

‘More Than Moore’ Reality Check
By Ann Mutschler - 14 May, 2020 - Comments: 1

The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

Inevitable Bugs
By Brian Bailey - 29 Apr, 2020 - Comments: 3

Are bug escapes inevitable? That was the fundamental question that Oski Technology recently put to a group of industry experts. The participants are primarily simulation experts who, in many cases, help direct the verification directions for some of the largest systems companies. In order to promote free discussion, all comments have been anonymized, distilling the primary thoughts of the parti... » read more

The Story Behind Advanced Packaging, Heterogeneous Integration and Test
By FormFactor - 06 Apr, 2020 - Comments: 0

The introduction of AMD’S FIJI chip a few years ago marked an important technology turning point for the semiconductor industry. This revolutionary graphics product delivered capability and innovation by relying on the first commercial example of 2.5D heterogenous integration, featuring a GPU assembled with High-Bandwidth-Memory (HBM) using Through-Silicon-Via (TSV) interconnect and interpose... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Mar, 2020 - Comments: 0

The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

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