tag: AMD

Verification Facing Unique Inflection Point
By Brian Bailey - 10 Mar, 2016 - Comments: 0

The Design and Verification Conference and Exhibition (DVCon) attracted more than 1,100 people to San Jose last week, just slightly less than last year. While a lot of focus, and most of the glory, goes to design within semiconductor companies, it is verification where most of the advancements are happening and thus the bigger focus for DVCon. The rate of change in verification and the producti... » read more

The Week In Review: Design/IoT
By Jesse Allen - 26 Feb, 2016 - Comments: 0

Tools Synopsys incorporated automated analog and mixed-signal debug capabilities into its Verdi SoC debug platform, which now provides comprehensive hierarchical and schematic views of both the analog and digital portions of designs and automated tracing across analog and digital blocks. Mentor announced three applications for the Veloce emulation platform focused on overcoming unpredicta... » read more

Racing To Design Chips Faster
By Ed Sperling - 25 Feb, 2016 - Comments: 6

A shift is underway to develop chips for more narrowly defined market segments, and in much smaller production runs. Rather than focusing on shrinking features and reducing cost per transistor by the billions of units, the emphasis behind this shift is less about scale and much more about optimization for specific markets and delivering those solutions more quickly. As automotive, consumer e... » read more

Inside Advanced Packaging
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

An Insider’s Guide To Planar And 3D DRAM
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to talk about planar DRAMs, 3D DRAMs, scaling and systems design with Charles Slayman, technical leader of engineering at network equipment giant Cisco Systems. What follows are excerpts of that conversation. SE: What types of DRAM do network equipment OEMs look at or buy these days? Slayman: When we look at DRAM, we look at it for networking applicatio... » read more

The Week In Review: Design/IoT
By Jesse Allen - 29 Jan, 2016 - Comments: 0

Mergers & Acquisitions Rambus expanded the scope of its Cryptography Research Division with the acquisition of UK-based Smart Card Software. The £64.7M ($91.84 million) deal comprises advanced mobile payment platform developer Bell ID as well as Ecebs, a supplier of smart ticketing systems to the UK transport markets. Tools & IP Mentor Graphics uncorked its Embedded Multicore ... » read more

Industry Road Map Under Construction
By Ed Sperling - 21 Jan, 2016 - Comments: 0

While most engineers think in terms of PPA—the classic power, performance and area tradeoffs—their bosses tend to see the world in terms of risk vs. opportunity. Until 22nm, these two objectives moved forward at roughly the same pace, despite the growing technical challenges of fitting more functionality into an SoC. Much has changed since then, and even more will change over the next f... » read more

Thinking Outside The Chip
By Ed Sperling - 14 Jan, 2016 - Comments: 0

Intel will begin adding 2.5D and 3D packaging into its processors, following the lead set by IBM and AMD in recognizing that new packaging approaches are essential for improving performance and lowering power. This shift won't derail the semiconductor industry's efforts to the reach future process nodes or continually shrink features, but it does add context for other factors that in... » read more

Reliability Adds Risk Over Time
By Ed Sperling - 07 Jan, 2016 - Comments: 1

Being able to connect devices to other devices has a long list of benefits, many of them related to the digitization of the analog or physical world. That includes all the benefits of being able to quantify, process and analyze information to to relay it in real time all over the globe. This is what's at the heart of the Internet of Things/Internet of Everything revolution. It's also at leas... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Dec, 2015 - Comments: 0

South Korea’s SK Hynix led the initial charge in the development of High Bandwidth Memory (HBM), a 3D DRAM technology based on a memory stack and through-silicon vias (TSVs). SK Hynix has been shipping HBM parts in the market. Now, SK Hynix and Samsung are readying the next version of the technology, dubbed High Bandwidth Memory 2 or HMB2, according to a report from The Electronic Times of So... » read more

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