tag: Cadence

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 04 Aug, 2023 - Comments: 0

Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Aug, 2023 - Comments: 0

Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

AI Transformer Models Enable Machine Vision Object Detection
By John Koon - 03 Aug, 2023 - Comments: 1

The object detection required for machine vision applications such as autonomous driving, smart manufacturing, and surveillance applications depends on AI modeling. The goal now is to improve the models and simplify their development. Over the years, many AI models have been introduced, including YOLO, Faster R-CNN, Mask R-CNN, RetinaNet, and others, to detect images or video signals, interp... » read more

Creating IP In The Shadow Of ISO 26262
By Karen Heyman - 03 Aug, 2023 - Comments: 0

On many levels, designing IP for the automotive sector is similar to targeting aerospace or medical devices — human lives are at risk if something goes wrong, and the list of regulations is significant. In practice, it can turn an interesting chip design project into a complex and often frustrating checklist exercise. In the case of ISO 26262, that includes a 12-part standard for automotiv... » read more

Boost Your CFD Workflow Productivity With An API: Part 1
By Veena Parthan - 03 Aug, 2023 - Comments: 0

If you're in the field of computational fluid dynamics testing or studies, you already know how much time and effort it takes to complete the tasks involved. Hours upon hours are spent on geometry clean-up, meshing, and post-processing. Furthermore, when you're dealing with similar models that have new constraints or dimensions, the work can feel tedious. But don't worry! There’s a way to sim... » read more

Blog Review: Aug. 2
By Jesse Allen - 02 Aug, 2023 - Comments: 0

Siemens' Katie Tormala points to the need for die attach thermal testing to ensure efficient removal of heat dissipation from power electronics components to prevent premature failure or thermal runaway. Synopsys's Dermott Lynch notes that over 30% of semiconductor failures are attributed to electrostatic discharge, with damage ranging from leakages and shorts to junction and metallization b... » read more

Week In Review: Design, Low Power
By Susan Rambo - 28 Jul, 2023 - Comments: 0

Arm is helping to address the ongoing talent shortage through its newly announced Semiconductor Education Alliance, with a long list of partners, including Arduino, Cadence, Cornell University, Semiconductor Research Corp., STMicroelectronics,Synopsys, Taiwan Semiconductor Research Institute, the All-India Council for Technical Education, and the University of Southampton. The Alliance... » read more

Shift Left, Extend Right, Stretch Sideways
By Brian Bailey - 27 Jul, 2023 - Comments: 0

The EDA industry has been talking about shift left for a few years, but development flows are now being stretched in two additional ways, extending right to include silicon lifecycle management, and sideways to include safety and security. In addition, safety and security join verification and power as being vertical concerns, and we are increasingly seeing interlinking within those concerns. ... » read more

The Good And Bad Of Chip Design On Cloud
By Ann Mutschler - 27 Jul, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about how the shift toward chip design on cloud has sped up, whether the benefits of cloud are realized in chip design, and some of the most pressing challenges to chip design on cloud today, with Philip Steinke, fellow, CAD infrastructure and physical design at AMD; Mahesh Turaga, vice president of business development for cloud at Cadence Design Syst... » read more

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