Transitioning To Photonics


Silicon photonics is undergoing a resurgence as traditional approaches for reducing power and heat become more difficult and expensive, opening the door to a whole new set of technological challenges and driving up demand for a skill set that is in short supply today. From a technology standpoint, photonics is extremely complex. Signals drift, they are modulated with heat, and structures lik... » read more

Printing Grids In 3D


Those of you who attended the 2011 Pointwise User Group Meeting may remember that our company president, John Chawner, mentioned during his closing statements how nice it would be to have the ability to print your grids in 3D. That was more than just a dreamy, "what if" statement. It is a reality! Almost. A little history 3D-printed F-16 forward fuselage. I have always been fascinat... » read more

RISC-V Driving New Verification Concepts


Semiconductor Engineering sat down to discuss gaps in tools and why new methodologies are needed for RISC-V processors, with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, ... » read more

Blog Review: April 12


Cadence's Ericles Sousa describes the five critical features of automotive SoC architectures that are essential for developing the next generation of passenger vehicles. In a podcast, Siemens' Steph Chavez chats with Gerry Partida of Summit Interconnect about the difficulties in collaboration between PCB designers and manufacturers, along with best practices that designers should follow to r... » read more

Challenges In Photonics Testing


Photonics is poised for significant growth due a rapid increase in data volumes and the need to move that data quickly and with minimal heat. But to reach its full potential photonics will have to overcome several production hurdles. The biggest challenge today involves alignment. While the industry is poised to produce billions of units, it still relies on testing practices that don't scale. ... » read more

Week In Review: Design, Low Power


MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, Mobility Tesla employees have been viewing customer videos, according to an investigative report by Reuters. The news outlet surveyed and interviewed Tesla employees, who described using the footage for both legitimate purposes and entertainment purposes within the company. Some employees forwarded videos to coworkers. Even Tesla CEO Elon Musk was not immune. Employees found an in... » read more

Chiplet Security Risks Underestimated


The semiconductor ecosystem is abuzz with the promise of chiplets, but there is far less attention being paid to security in those chiplets or the heterogeneous systems into which they will be integrated. Disaggregating SoCs into chiplets significantly alters the cybersecurity threat landscape. Unlike a monolithic multi-function chip, which usually is manufactured using the same process tech... » read more

Growing Challenges For Increasingly Connected Vehicles


Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

What’s Required To Secure Chips


Experts at the Table: Semiconductor Engineering sat down to talk about how to verify that a semiconductor design will be secure, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketing at Expedera; and Dave Kelf, CEO of Breker Verification. ... » read more

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