tag: chiplets

Hunting For Open Defects In Advanced Packages
By Anne Meixner - 17 Mar, 2021 - Comments: 5

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for these chips, the greater the effort and the cost. Latent open defects continue to be the bane of test, quality, and reliability engineering. Open defects in packages occur at the chip-to-substra... » read more

Tradeoffs To Improve Performance, Lower Power
By Ann Mutschler - 11 Mar, 2021 - Comments: 0

Generic chips are no longer acceptable in competitive markets, and the trend is growing as designs become increasingly heterogeneous and targeted to specific workloads and applications. From the edge to the cloud, including everything from vehicles, smartphones, to commercial and industrial machinery, the trend increasingly is on maximizing performance using the least amount of energy. This ... » read more

Die-To-Die Chiplet Communication
By Paul McLellan - 11 Mar, 2021 - Comments: 0

At CadenceLIVE Americas 2020, one of the most viewed videos was by Samsung Foundry's Kevin Yee and Cadence's Tom Wong, titled "Let’s Talk About Chips (Chiplets), Baby…It’s All About D2D!" They went for this title because it reminded them of the lyrics of an '80s song...which they proceeded to sing. Process and packaging trends Tom led off with a look at the trends in semiconducto... » read more

Chiplets For The Masses
By Brian Bailey - 03 Mar, 2021 - Comments: 2

Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

Roaring ’20s For The Chip Industry
By Brian Bailey - 28 Jan, 2021 - Comments: 0

2020 was a good year for the semiconductor industry and the EDA industry that fuels it, but 2021 has the opportunity to be even better. New end application markets continue to open, and what were once seen as technical hurdles are leading to a multitude of innovative solutions, all of which need suitable tooling. No company can afford to invest everywhere, and so for EDA companies, their rel... » read more

The Chip Industry’s Next-Gen Roadmap
By Mark LaPedus - 21 Jan, 2021 - Comments: 1

Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Is Computing Facing An Energy Crisis?
By Rob Aitken - 14 Jan, 2021 - Comments: 1

Is the end near? If the topic is energy efficiency gains in computing, the answer depends on whom you ask. The steady increase in performance per watt over the decades has been one of the most important drivers in our industry. Last year I was thumbing through a neighbor’s 1967 Motorola IC catalog that featured such space age wonders as a small control chip of the sort that went into th... » read more

Chiplets And Heterogeneous Packaging Are Changing System Design And Analysis
By Cadence - 21 Dec, 2020 - Comments: 0

In the domain of electronic product design, solely relying on process shrink as the primary driver of product innovation and improved system performance is no longer a viable approach. The cost and complexity associated with advanced nodes has everyone looking for alternatives to the traditional monolithic system on chip (SoC). The path most are taking leads to the world of “More than Moore�... » read more

Emerging Apps And Challenges For Packaging
By Mark LaPedus - 23 Nov, 2020 - Comments: 0

Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Disaggregation And Smarter Chips Shift Liability For Security
By Ed Sperling - 17 Nov, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security on chips with Vic Kulkarni, vice president and chief strategist at Ansys; Jason Oberg, CTO and co-founder of Tortuga Logic; Pamela Norton, CEO and founder of Borsetta; Ron Perez, fellow and technical lead for security architecture at Intel; and Tim Whitfield, vice president of strategy at Arm. What follows are excerpts of that conversation,... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy