tag: EUV

BEOL Issues At 10nm And 7nm
By Ed Sperling - 31 Jan, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

Changing Direction In Chip Design
By Ed Sperling - 26 Jan, 2017 - Comments: 1

Andrzej Strojwas, chief technologist at PDF Solutions and professor of electrical and computer engineering at Carnegie Mellon University—and the winner of this year's Phil Kaufman Award for distinguished contributions to EDA—sat down with Semiconductor Engineering to talk about device scaling, why the semiconductor industry will begin to fragment around new architectures and packaging, and ... » read more

What’s Next For Transistors
By Mark LaPedus - 23 Jan, 2017 - Comments: 1

The IC industry is moving in several different directions at once. The largest chipmakers continue to march down process nodes with chip scaling, while others are moving towards various advanced packaging schemes. On top of that, post-CMOS devices, neuromorphic chips and quantum computing are all in the works. Semiconductor Engineering sat down to discuss these technologies with Marie Semeri... » read more

Will EUV Kill Multi-Patterning?
By David Abercrombie - 19 Jan, 2017 - Comments: 0

When I first began working on double-patterning (DP) tools back in late 2010, there was already talk that it might be a fruitless, or at a minimum, very short-lived project, as extreme ultraviolet (EUV) lithography was just around the corner and would make all multi-patterning (MP) obsolete. Well, as I begin my seventh year on this project, I can hear echoes of Mark Twain as clearly, the report... » read more

5 Takeaways From ISS
By Mark LaPedus - 19 Jan, 2017 - Comments: 1

At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. It also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Bullish outlook Citing an inventory corre... » read more

Inside Photomask Writing
By Mark LaPedus - 19 Jan, 2017 - Comments: 0

Hirokazu Yamada, a board member and the director of the Mask Lithography Division of NuFlare, sat down with Semiconductor Engineering to discuss photomask technology, e-beam mask writer trends and other topics. NuFlare is the world’s largest supplier of e-beam mask writers. What follows are excerpts of that conversation. SE: How does the [getkc id="265" kc_name="photomask"] market look in... » read more

TSMC: 10nm To Be Greater Than 10% Of 2017 Wafer Revenue
By Barry Pangrle - 18 Jan, 2017 - Comments: 2

TSMC’s financial results for the 4th Quarter of 2016 were released on January 11, 2017 (PST) and showed that year-over-year fourth quarter revenue increased 28.8% and simultaneously net income and diluted EPS both increased 37.6%.  In U.S. dollars, TSMC’s fourth quarter revenue was $8.25 billion. TSMC's CFO, Ms. Lora Ho, reported that 2016 was a good year for TSMC and that the company set ... » read more

Manufacturing Bits: Jan. 10
By Mark LaPedus - 10 Jan, 2017 - Comments: 2

Atom interferometers The Massachusetts Institute of Technology (MIT) has devised one of the world’s most accurate atom interferometers. Interferometry is a common measurement technique. Basically, the technology looks at electromagnetic waves. The waves are superimposed to extract information. One interferometry technology type, called an atom interferometer, utilizes the waves of ato... » read more

BEOL Issues At 10nm And 7nm (part 2)
By Ed Sperling - 04 Jan, 2017 - Comments: 3

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

Reflecting Back On 2016
By Brian Bailey - 22 Dec, 2016 - Comments: 0

Anyone can make a prediction, and sometimes the more outlandish they are the more they get noticed. But at the end of the year some people hit the mark while others may have been way off. Many people simply make projections based on the current trajectory of trends, while others look for the potential discontinuities that may lie ahead. Semiconductor Engineering examines the projections made... » read more

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