Manufacturing Bits: May 5

By Mark LaPedus - 05 May, 2015 - Comments: 0

Transparent armor The U.S. Naval Research Laboratory (NRL) has developed transparent armor. The technology is actually a hard transparent ceramic, based on a material called spinel. Spinel is a magnesium aluminate compound. Spinel is also a gemstone, which could come in various colors. NRL has devised a fabrication process to create the technology, which is harder and superior to glass, sap... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 24 Apr, 2015 - Comments: 0

For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above work for Altera. This quarter, Altera was supposed to select a foundry partner for 10nm. This week, Altera posted lackluster results in the quarter. Altera did not elaborate on its 10nm plans, nor did it discuss the Intel rumors. "Altera did n... » read more

Moore’s Law At 50

By Ed Sperling - 23 Apr, 2015 - Comments: 0

Moore's Law turned 50 this week…but not because of Gordon Moore. He observed that the number of transistors crammed onto a piece of silicon was doubling every 18 to 24 months and predicted that would continue to be the case. He was right, but it took many thousands of engineers who created methodologies and tools to automate the design and equipment to manufacture complex chips to make that o... » read more

Next EUV Challenge: Mask Inspection

By Mark LaPedus - 16 Apr, 2015 - Comments: 2

Extreme ultraviolet ([gettech id="31045" comment="EUV"]) lithography is still not ready for prime time, but the technology finally is moving in the right direction. The EUV light source, for example, is making progress after years of delays and setbacks. Now, amid a possible breakthrough in EUV, the industry is revisiting a nagging issue and asking a simple question: How do you inspect EUV p... » read more

How We’ll Get There from Here

By Brian Fuller - 09 Apr, 2015 - Comments: 0

The electronics industry is like a battleship with remarkable handling properties. I thought about it this week sitting at an industry event a day after stumbling across Neptune—the technology project, not the god. Those two experiences forced me to rethink some fundamental assumptions about system design and how the ecosystem responds to change. If you’ve not heard of Neptune, it�... » read more

Challenges Mount For Patterning And Masks

By Mark LaPedus - 06 Apr, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss [getkc id="80" comment="lithography"] and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief execu... » read more

Challenges Mount For Patterning And Masks

By Mark LaPedus - 30 Mar, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss lithography and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch Business Unit at [getentity id="22817" e_name="Applied Materials"]; Pawitter Mangat, senior manager and deputy director for EUV lithography at [getentity id="22819" comment="GlobalFoundries"]; Aki Fujimura, chief executive at [getentity id="228... » read more

5 Reasons EUV Will Or Won’t Be Used

By Michael Watts - 19 Mar, 2015 - Comments: 1

Digging into this subject, there are five metrics that count in a lithography tool: resolution, throughput, defects, overlay, and reliability. So what does the best data tell us about the current state and realistic prognosis for [gettech id="31045" comment="EUV"]. Semiconductor Engineering posed this question to Matt Colburn, senior manager for patterning research at [getentity id="22306" comm... » read more

3D Effects At 20nm And Beyond

By Ann Mutschler - 19 Mar, 2015 - Comments: 0

At the 20nm process node and below, attenuated phase shift masks (PSM) are used in the photolithography process, which results in approximately 70nm of topography. This now must be accounted for using 3D mask approximation. Aki Fujimura, CEO of [getentity id="22864" comment="D2S"], explained that in terms of [getkc id="80" comment="lithography"], where simulation-based technologies are used,... » read more

Challenges Mount For Patterning And Masks

By Mark LaPedus - 19 Mar, 2015 - Comments: 0

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tag: EUV

Manufacturing Bits: May 5

The Week In Review: Manufacturing

Moore’s Law At 50

Next EUV Challenge: Mask Inspection

How We’ll Get There from Here

Challenges Mount For Patterning And Masks

Challenges Mount For Patterning And Masks

5 Reasons EUV Will Or Won’t Be Used

3D Effects At 20nm And Beyond

Challenges Mount For Patterning And Masks