tag: IBM

Manufacturing Bits: June 30
By Mark LaPedus - 30 Jun, 2020 - Comments: 0

1μm pitch wafer bonding At the recent IEEE Electronic Components and Technology Conference (ECTC), Imec presented a paper on a fine-pitch hybrid wafer-to-wafer bonding technology for heterogeneous integration. Imec described a way to enable hybrid bond pitches down to 1μm using a novel Cu/SiCN (copper/silicon-carbon-nitrogen) surface topography. Today, the industry is developing or shi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Jun, 2020 - Comments: 0

Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 26 Jun, 2020 - Comments: 0

Security The U.S. Defense Advanced Research Projects Agency (DARPA) selected Synopsys as the main contractor to provide SoC design tools and security IP for its Automatic Implementation of Secure Silicon (AISS) program. The four-year program’s goal to develop a design tool and IP ecosystem to automate adding security into integrated circuits. Synopsys will be working on a research team with ... » read more

Challenges For Compute-In-Memory Accelerators
By Katherine Derbyshire - 18 Jun, 2020 - Comments: 1

A compute-in-memory (CIM) accelerator does not simply replace conventional logic. It's a lot more complicated than that. Regardless of the memory technology, the accelerator redefines the latency and energy consumption characteristics of the system as a whole. When the accelerator is built from noisy, low-precision computational elements, the situation becomes even more complex. Tzu-Hsian... » read more

Fundamental Changes In Economics Of Chip Security
By Ed Sperling - 10 Jun, 2020 - Comments: 0

Protecting chips from cyberattacks is becoming more difficult, more expensive and much more resource-intensive, but it also is becoming increasingly necessary as some of those chips end up in mission-critical servers and in safety-critical applications such as automotive. Security has been on the semiconductor industry's radar for at least the past several years, despite spotty progress and ... » read more

(Artificially) Intelligent Verification
By Brian Bailey - 01 Jun, 2020 - Comments: 1

Functional verification produces a lot of data, , but does that make it suitable for Artificial Intelligence (AI) or Machine Learning (ML)? Experts weigh in about where and how AI can help and what the industry could do to improve the benefits. "It's not necessarily the quantity," says Harry Foster, chief scientist for verification at Mentor, a Siemens Business. "It's the quality that matter... » read more

EUV’s Uncertain Future At 3nm And Below
By Mark LaPedus - 21 May, 2020 - Comments: 5

Several foundries have moved extreme ultraviolet (EUV) lithography into production at both 7nm and 5nm, but now the industry is preparing for the next phase of the technology at 3nm and beyond. In R&D, the industry is developing new EUV scanners, masks and resists for the next nodes. 3nm is slated for 2022, followed by 2nm a year or two later. Nonetheless, it will require massive funding... » read more

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2020 - Comments: 1

Gate-all-around reliability The 2020 IEEE International Reliability Physics Symposium (IRPS) will kick off this week, this time as a virtual event. IRPS is a conference that focuses on the latest research in microelectronics reliability. The event starts off with keynotes from Infineon, Intel and Texas Instruments. IRPS also involves a multitude of papers and presentations. On the logi... » read more

Practical Processor Verification
By Brian Bailey - 23 Apr, 2020 - Comments: 0

Custom processors are making a resurgence, spurred on by the early success of the RISC-V ISA and the ecosystem that is rapidly building around it. But this shift is amid questions about whether processor verification has become a lost art. Years ago custom processors were common. But as the market consolidated around a handful of companies, so did the tools and expertise needed to develop th... » read more

Making Chips At 3nm And Beyond
By Mark LaPedus and Ed Sperling - 16 Apr, 2020 - Comments: 4

Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

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