Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 26 May, 2023 - Comments: 1

The Cyberspace Administration of China recommended a ban of Micron chips for critical information infrastructure (CII), alleging serious network security risks. According to a statement from China's Network Security Review Office, "Micron's products have relatively serious potential network security issues, which pose a major security risk to [China's] critical information infrastructure supply... » read more

Blog Review: May 24

By Jesse Allen - 24 May, 2023 - Comments: 0

Siemens' Patrick McGoff finds that designers have not had easy tools to address solderability, leaving a critical part of the manufacturing success of a PCB to the component engineer or the contract manufacturer, and points to manufacturing-driven design as a way to avoid quality issues later. Cadence's Rich Chang finds that effective UPF low-power verification and debug involves more than o... » read more

Week In Review: Design, Low Power

By Susan Rambo - 19 May, 2023 - Comments: 0

Design Ansys has signed a definitive agreement to acquire EDA tool company Diakopto. Diakopto specializes in software tools that find the cause of layout parasitics. Its products are ParagonX, for analyzing and debugging IC designs and layout parasitics, and EM/IR analysis/verification tool PrimeX. The deal is expected to close in the second quarter of 2023. SEMI’s FlexTech community issu... » read more

Blog Review: May 17

By Jesse Allen - 17 May, 2023 - Comments: 0

Synopsys' Dana Neustadter examines the key industries driving Ethernet security, challenges to securing Ethernet networks, and the MACsec protocol that guards against network data breaches by encrypting data traffic between Ethernet-connected devices. Siemens' Stephen Chavez points to the improvements gained from design reuse in PCB design but warns that inefficient processes for managing an... » read more

Machine Vision Plus AI/ML Adds Vast New Opportunities

By John Koon - 17 May, 2023 - Comments: 0

Traditional technology companies and startups are racing to combine machine vision with AI/ML, enabling it to "see" far more than just pixel data from sensors, and opening up new opportunities across a wide swath of applications. In recent years, startups have been able to raise billions of dollars as new MV ideas come to light in markets ranging from transportation and manufacturing to heal... » read more

Blog Review: May 10

By Jesse Allen - 10 May, 2023 - Comments: 0

Synopsys' Alessandra Nardi and Uyen Tran explain how to meet quality, reliability, functional safety, and security requirements of automotive chips through thorough test programs, path-margin monitoring, and design failure mode and effect analysis (DFMEA). Cadence's Veena Parthan explores how computational fluid dynamics can help predict and model the generation, propagation, and mitigation ... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 28 Apr, 2023 - Comments: 0

The U.S. Commerce Department launched Chips.gov, a website that covers all aspects of the CHIPS Act, including funding opportunities and job openings. In similar vein, Intel CEO Pat Gelsinger focused on the future of semiconductor manufacturing in America in a talk at MIT. Intel has committed to expanding semiconductor manufacturing in the U.S., including spending an initial $20 billion on ne... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 28 Apr, 2023 - Comments: 0

Pervasive computing Renesas introduced a narrowband Internet of Things (NB-IoT) chipset and dev kit for the Indian market. The LTE NB-IoT modem chipset, the RH1NS200, was designed for Indian telecommunications carriers by targeting bands 1,3, 5 and 8 and by following India’s carrier-approved LTE protocol stack and software suite. Low power usage is built in — it has a low Power Saving Mode... » read more

New Standards Push Co-Packaged Optics

By Karen Heyman - 26 Apr, 2023 - Comments: 0

Co-packaged optics (CPOs) promise five times the bandwidth of pluggable connections, but the new architecture requires multiple changes to accommodate different applications. The Optical Internetworking Forum (OIF) recently published standards for co-packaged optics, which are the photonic industry’s hope for handling today’s faster Ethernet interfaces, as well as increasing speeds and p... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 21 Apr, 2023 - Comments: 0

GlobalFoundries filed suit in U.S. District Court in New York against IBM, accusing it of unlawfully disclosing IP and trade secrets to IBM partners, including Intel and Rapidus, potentially receiving hundreds of millions of dollars in licensing income and other benefits. The European Union released a €43 billion ($47 billion) plan for jumpstarting its semiconductor manufacturing industry,... » read more

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tag: Intel

Week In Review: Semiconductor Manufacturing, Test

Blog Review: May 24

Week In Review: Design, Low Power

Blog Review: May 17

Machine Vision Plus AI/ML Adds Vast New Opportunities

Blog Review: May 10

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

New Standards Push Co-Packaged Optics

Week In Review: Semiconductor Manufacturing, Test