Week In Review: Semiconductor Manufacturing, Test

Intel scraps Tower takeover; Si wafer supply up; DOE funds wide-bandgap chips; cyber-threats grow for IC manufacturing; DSA’s second chance; Synopsys-Intel IP agreement; 3D in-memory compute.


Intel dropped out of a $5.4 billion deal to purchase Tower Semiconductor in Israel. Intel cited the inability to obtain regulatory approval in a timely manner as the reason for ending the deal signed in February. Intel will pay a $353 million termination fee to Tower.

The silicon wafer supply has moved back into positive territory for 2023 thanks to a 7% decline in wafer shipments combined with increased manufacturing, according to a new report from TECHCET. Growth in demand is expected to rebound in 2024 with a  projected CAGR of 6% through 2027.

The U.S. Dept. of Energy renewed funding for PowerAmerica, the DOE’s Clean Energy Manufacturing Innovation Institute, to continue advanced domestic manufacturing of next-generation wide-bandgap (WBG) semiconductors. PowerAmerica will receive an initial investment of $8 million, with potential funding across four more fiscal years to follow.

Securing chip manufacturing against growing cyber threats and increasingly sophisticated and resourceful hackers is an industry-wide concern for securing the global supply chain.

Synopsys and Intel entered into a multi-generational agreement to expand their IP and EDA strategic partnership. The IP is targeted at the Intel 3 and Intel 18A process technologies.

3D in-memory compute is making progress as research at VLSI Symposium turns to indium oxides for BEOL integration.

Directed Self-Assembly (DSA) finally is finding its footing in the semiconductor industry, but not for its original purpose.

David Fromm will take the role of COO at Promex in addition to his role as vice president of engineering. Fromm will be responsible for the full breadth of operations at Promex, including technical developments for high-quality, scalable assembly and manufacturing of complex medical devices that incorporate microelectronics. Fromm joined Promex in April of this year.

Brewer Science announced the expansion of its manufacturing facility in Vichy, Missouri. The expansion adds 50% more floor space designated for advanced manufacturing, packaging, and warehouse capacity.

Infineon announced an expanded partnership with Chicony Power to produce GaN-based power adapter solutions for notebooks. The new solutions provide more than a 30% increase in power density.

Researchers from the Max Planck Institute of Microstructure Physics, University of Cambridge and the University of Pennsylvania have reported the growth of high-quality, single-crystal thin films of T-Nb2O5, aligned in such a way that the lithium ions can move significantly faster along 2D vertical ionic transport channels. “This work showcases a synergistic experiment–theory approach to develop new ionically channelled devices for diverse applications, including thin-film batteries, electrochromic devices, neuromorphic devices and electrochemical random-access memory,” states the paper.


Further reading

See our Test, Measurement & Analytics newsletter for these feature articles:

  • SiC Growth For EVs Is Stressing Manufacturing
  • Navigating the Metrology Maze for GAA FETs
  • Using Generative AI To Connect Lab To Fab Test

Find the latest Manufacturing, Packaging and Materials newsletter here.

Upcoming events in the chip industry:

  • SPIE Optics + Photonics 2023, Aug. 20 – 24 (San Diego, CA)
  • DARPA: Electronics Resurgence Initiative (ERI), Aug. 22 – 24 (Seattle, WA)
  • Hot Chips 2023, Aug. 27 – 29 (Hybrid/Stanford University)
  • IEEE International System-on-Chip Conference (SOCC): SoCs/SiPs for Edge Intelligence & Accelerated Computing, Sept. 5 – 8 (Santa Clara, CA)

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