DARPA and a number of major vendors are backing this modular approach, but hurdles remain.

D2S’ CEO sounds off on the impact of deep learning, EUV and other manufacturing advancements.

Improvements in power, performance and area are much more difficult to achieve, but solutions are coming into focus.

It’s been an uneven path leading to the current state of AI, and there’s still a lot of work ahead.

Using the Von Neumann architecture for artificial intelligence applications is inefficient. What will replace it?

Why packaging is becoming increasingly critical and difficult in the automotive market.

Costs of developing a complex chip could run as high as $1.5B, while power/performance benefits are likely to decrease.

Lines blur as processors are added into traditional FPGAs, and programmability is added into ASICs.

Technology has the potential to reshape processing everywhere, starting with limited scientific and commercial applications.

Shortages of used equipment and lower margins mean this problem isn’t getting solved anytime soon.

5G is driving up demand for both 300mm and 200mm capacity. Both are in short supply.

Most attacks in the past focused on gaining access to software, but Meltdown and Spectre have changed that forever.

Experts at the Table, part 1: Why machine learning works in some cases and not in others.