tag: DSA

Define & Grow III–V Vertical Nanowires At A High Footprint Density on a Si Platform
By Technical Paper Link - 29 Jul, 2022 - Comments: 0

New technical paper titled "Directed Self-Assembly for Dense Vertical III–V Nanowires on Si and Implications for Gate All-Around Deposition" is published from researchers at Lund University in Sweden. Abstract: "Fabrication of next generation transistors calls for new technological requirements, such as reduced size and increased density of structures. Development of cost-effective proc... » read more

Manufacturing Bits: Nov. 2
By Mark LaPedus - 02 Nov, 2021 - Comments: 0

IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

ACAP At The Edge With The Versal AI Edge Series
By Xilinx - 30 Jun, 2021 - Comments: 0

This white paper introduces the AI Edge series to the Versal ACAP portfolio, a domain-specific architecture (DSA) that meets the strenuous demands of systems implemented in the 7nm silicon process. This series is optimized to meet the performance-per-watt requirements of edge nodes at or near the analog-digital boundary. Here, immediate response to the physical world is highly valued, and in ma... » read more

Ten Lessons From Three Generations Shaped Google’s TPUv4i
By Technical Paper Link - 11 Jun, 2021 - Comments: 0

Source: Norman P. Jouppi, Doe Hyun Yoon, Matthew Ashcraft, Mark Gottscho, Thomas B. Jablin, George Kurian, James Laudon, Sheng Li, Peter Ma, Xiaoyu Ma, Nishant Patil, Sushma Prasad, Clifford Young, Zongwei Zhou (Google); David Patterson (Google / Berkeley) Find technical paper here. 2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture (ISCA) Abstract–"Google de... » read more

Versal: The First Adaptive Compute Acceleration Platform (ACAP)
By Xilinx - 01 Dec, 2020 - Comments: 0

Recent technical challenges have forced the industry to explore options beyond the conventional “one size fits all” CPU scalar processing solution. Very large vector processing (DSP, GPU) solves some problems, but it runs into traditional scaling challenges due to inflexible, inefficient memory bandwidth usage. Traditional FPGA solutions provide programmable memory hierarchy, but the tradit... » read more

Interconnect Challenges Grow, Tools Lag
By Brian Bailey - 15 Jun, 2020 - Comments: 2

Interconnects are becoming much problematic as devices shrink and the amount of data being moved around a system continues to rise. This limitation has shown up several times in the past, and it's happening again today. But when the interconnect becomes an issue, it cannot be solved in the same way issues are solved for other aspects of a chip. Typically it results in disruption in how the t... » read more

Lithography Options For Next-Gen Devices
By Mark LaPedus - 18 Apr, 2019 - Comments: 2

Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table. For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more

Single Vs. Multi-Patterning EUV
By Mark LaPedus - 25 Mar, 2019 - Comments: 5

Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

EUV Arrives, But More Issues Ahead
By Katherine Derbyshire - 21 Mar, 2019 - Comments: 5

EUV has arrived. After decades of development and billions of dollars of investment, EUV lithography is taking center stage at the world’s leading fabs. More than 20 years after ASML's extreme ultraviolet lithography research program began, and nearly a decade after its first pre-production exposure tools, the company expects to deliver 30 EUV exposure systems in 2019. That is nearly doubl... » read more

Top Tech Talks Of 2018
By Linda Christensen - 31 Dec, 2018 - Comments: 0

2018 shaped up to be a year of transition and inflection, sometimes in the same design. There were new opportunities in automotive, continued difficulties in scaling, and an explosion in AI and machine learning everywhere. Traffic numbers on stories give a snapshot of the most current trends, but with videos those trends are even more apparent because of the time invested in watching those v... » read more

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