tag: Intel

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

Run Simulations at Top Speed
By Ansys - 12 Aug, 2020 - Comments: 0

The Ansys Fluent solver can be so computationally demanding that complex simulations can take hours to complete. Ansys and Intel worked together to build a new smoother and optimize it for Intel Xeon Scalable processors to help reduce those long simulation times. This whitepaper reviews the results of performance testing conducted with Ansys Fluent 2020 R1 when making use of the Intel MKL sp... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 07 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Codasip and Metrics Design Automation announced they have integrated Metrics’ SystemVerilog RTL Simulation Platform within Codasip’s SweRV Core Support Package, version, and it will be accessible on the cloud. Aldec’s TySOM Embedded Development Kits have qualified for Amazon Web Services (AWS) IoT Greengrass. TySOM is a family of Xilinx Z... » read more

Accellera Tackles Functional Safety
By Paul McLellan - 06 Aug, 2020 - Comments: 0

During DAC, Accellera had a workshop about functional safety. In case you don't know, Accellera has a relatively new working group (WG) on Functional Safety. The chair is Cadence's Alessandra Nardi, who coincidentally also received the Marie Pistilli Award for Women in EDA during DAC (you can read more about that in my post Alessandra Nardi Receives Marie Pistilli Award for Women in EDA). But ... » read more

Power/Performance Bits: Aug. 4
By Jesse Allen - 04 Aug, 2020 - Comments: 0

Assessing code similarity Researchers from Intel, MIT, and Georgia Institute of Technology created an automated engine designed to learn what a piece of software intends to do by studying the structure of the code and analyzing syntactic differences of other code with similar behavior. The machine inferred code similarity (MISIM) program, a subset of Intel's work on machine programming, was... » read more

Rethinking Competitive One Upmanship Among Foundries
By Ed Sperling - 03 Aug, 2020 - Comments: 2

The winner in the foundry business used to be determined by who got to the most advanced process node first. For the most part that benchmark no longer works. Unlike in the past, when all of the foundries and IDMs competed using basically the same process, each foundry has gone its own route. This is primarily due to the divergence of end markets, and the realization that as costs increase, ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Jul, 2020 - Comments: 0

Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 31 Jul, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT, 5G Qualcomm settled its 5G licensing disagreement with Huawei, which will pay $1.8 billion in back royalties and will pay for licensing going forward. Huawei is also now the world’s largest supplier of smartphones, surpassing Samsung Electronics Co. Qualcomm also announced a super-fast charging platform this week for Android devices that is sup... » read more

Next Challenge: Parts Per Quadrillion
By Ed Sperling - 29 Jul, 2020 - Comments: 0

Requirements for purity of the materials used in semiconductor manufacturing are being pushed to unprecedented — and increasingly unprovable — levels as demand for reliability in chips over increasingly longer lifetimes continues to rise. And while this may seem like a remote problem for many parts of the supply chain, it can affect everything from availability of materials needed to make t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Jul, 2020 - Comments: 0

Semicon recap The virtual version of Semicon West took place this week. Virtual events have their places. It’s no substitute for an in-person event. Nonetheless, the virtual version of Semicon West is still a place to get an update on the latest equipment, test and packaging technologies. It is also interesting to visit the virtual booths. It’s a fast way to meet people. I chatted with ... » read more

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