Toward A 5G, AI-Centric World

By Sundeep Bajikar - 19 Apr, 2018 - Comments: 0

The market environment over the coming years will continue to experience an explosion of data generation from a variety of new sources such as smart cars, smart factories, smart hospitals and smart network infrastructure. Data explosion combined with artificial intelligence (AI) will create a renaissance of computing and storage hardware. Mobile World Congress 2018 (MWC) reinforced this market ... » read more

New Patterning Options Emerging

By Mark LaPedus - 19 Apr, 2018 - Comments: 1

Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are developing self-aligned technologies based on a variety of new approaches. The latest approach involves self-aligned patterning techniques with multi-color material schemes, which are designed for us... » read more

Searching For EUV Defects

By Mark LaPedus - 19 Apr, 2018 - Comments: 1

Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this oft-delayed technology can be used in production. One lingering issue that is becoming more worrisome is how to find defects caused by [gettech id="31045" comment="EUV"] processes. These processes can cause random variations, also known as stochastic effects... » read more

Designing 5G Chips

By Ann Mutschler - 18 Apr, 2018 - Comments: 0

5G is the wireless technology of the future, and it’s coming fast. The technology boasts very high-speed data transfer rates, much lower latency than 4G LTE, and the ability to handle significantly higher densities of devices per cell site. In short, it is the best technology for the massive amount of data that will be generated by sensors in cars, IoT devices, and a growing list of next-g... » read more

Choosing The Right Interconnect

By Ed Sperling - 09 Apr, 2018 - Comments: 3

Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

The Week In Review: Design

By Jesse Allen - 06 Apr, 2018 - Comments: 0

Tools Mentor, a Siemens business, filled in the last of the hardware configurations for its Veloce Strato emulation family, creating a full upgrade path. Users can initially purchase only the hardware that they need (StratoTiL) and if later they require more capacity (StratoTi) or the ability to handle larger designs (StratoT), they can incrementally add the necessary hardware to their existin... » read more

What Happened To Nanoimprint Litho?

By Mark LaPedus - 29 Mar, 2018 - Comments: 4

Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

Blog Review: March 28

By Jesse Allen - 28 Mar, 2018 - Comments: 0

Mentor's Joe Hupcey III and Jin Hou explain how to use the Open Verification Language (OVL) library of assertions to build an effective formal testbench. In a video, Cadence's Marc Greenberg discusses the benefits of moving non-volatile memory from the SSD to the DDR bus and possible new storage-class memories. Synopsys' Anders Nordstrom argues that security can no longer be ignored when ... » read more

The Week in Review: IoT

By Jeff Dorsch - 23 Mar, 2018 - Comments: 0

Finance Bestmile, which offers a mobility platform for managing autonomous vehicle fleets, raised $11 million in Series A funding led by Road Ventures SA. Also participating in the round are Partech Ventures, Groupe ADP, Airbus Ventures, Serena Capital, and MobilityFund. The startup, incorporated in 2014, will use the money for worldwide expansion, strengthening its cloud-based mobility platfo... » read more

Blog Review: Mar. 21

By Jesse Allen - 21 Mar, 2018 - Comments: 0

Mentor's Colin Walls shares five more quick tips for embedded software programming, including t real time systems, programming philosophy, and C++ operator overloading. Cadence's Paul McLellan digs into recently released semiconductor company ratings, the role of memory in shaking up the list, and China's plans for more 3D NAND and DRAM fabs. Synopsys' Taylor Armerding examines the latest... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?