Lithography Options For Next-Gen Devices

By Mark LaPedus - 18 Apr, 2019 - Comments: 2

Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table. For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more

Lithography Challenges For Leading Edge 3D Packaging Applications

By Veeco - 18 Apr, 2019 - Comments: 0

Leading edge consumer electronic products drive demand for enhanced performance and small form factors. This in turn drives manufacturing requirements for all aspects of semiconductor device fabrication. As the cost of front end device manufacturing continues to escalate rapidly with each new technology node, semiconductor manufacturing companies are now also focusing on packaging technology to... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 29 Mar, 2019 - Comments: 0

Materials Wesfarmers, an Australian diversified firm, has made an unsolicited bid to acquire Lynas, one of the world’s largest suppliers of rare earths outside of China. Rare earths are chemical elements found in the Earth’s crust. They are used in cars, consumer electronics, computers, communications, clean energy and defense systems. The big market for rare earths is magnets. In semicond... » read more

EUV Arrives, But More Issues Ahead

By Katherine Derbyshire - 21 Mar, 2019 - Comments: 5

EUV has arrived. After decades of development and billions of dollars of investment, EUV lithography is taking center stage at the world’s leading fabs. More than 20 years after ASML's extreme ultraviolet lithography research program began, and nearly a decade after its first pre-production exposure tools, the company expects to deliver 30 EUV exposure systems in 2019. That is nearly doubl... » read more

Manufacturing Bits: March 11

By Mark LaPedus - 11 Mar, 2019 - Comments: 0

Measuring molecules The Technical University of Munich (TUM) has developed a new metrology technique that determines the properties of individual molecules. The technique, called single-molecule excitation–emission spectroscopy, improves upon the traditional methods to explore molecules. The traditional method, dubbed single-molecule spectroscopy (SMS), is not new and is used to analyze f... » read more

Using Sensor Data To Improve Yield And Uptime

By Ed Sperling - 21 Feb, 2019 - Comments: 2

Semiconductor equipment vendors are starting to add more sensors into their tools in an effort to improve fab uptime and wafer yield, and to reduce cost of ownership and chip failures. Massive amounts of data gleaned from those tools is expected to provide far more detail than in the past about multiple types and sources of variation, including when and where that variation occurred and how,... » read more

Comparative Stochastic Process Variation Bands For N7, N5, And N3 At EUV

By KLA - 21 Feb, 2019 - Comments: 0

By Alessandro Vaglio Preta, Trey Gravesa, David Blankenshipa, Kunlun Baib, Stewart Robertsona, Peter De Bisschopc, John J. Biaforea a) KLA-Tencor Corporation, Austin, TX 78759, U.S.A. b) KLA-Tencor Corporation, Milpitas, CA 95035, U.S.A. c) IMEC, Kapeldreef 75, 3000, BE ABSTRACT Stochastics effects are the ultimate limiter of optical lithography technology and are a major concern for n... » read more

Lithography Challenges For Fan-out

By Mark LaPedus - 12 Feb, 2019 - Comments: 3

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages are migrating toward the 1µm line/space barrier and beyond, which is considered a milestone in the industry. At these critical dimensions (CDs), fan-outs will provide better per... » read more

Manufacturing Bits: Feb. 5

By Mark LaPedus - 05 Feb, 2019 - Comments: 1

Multi-beam litho shakeout The multi-beam e-beam market for lithography applications continues to undergo a shakeout amid technical roadblocks and other issues. Last week, ASML announced that it had acquired the intellectual-property (IP) assets of Mapper Lithography, a Dutch supplier of multi-beam e-beam tools for lithography applications that fell into bankruptcy late last year. As it t... » read more

EUV Mask Blank Battle Brewing

By Mark LaPedus - 15 Nov, 2018 - Comments: 2

Amid the ramp of extreme ultraviolet (EUV) lithography in the market, suppliers of EUV mask blanks are expanding their production. And a new player—Applied Materials—is looking to enter the market. AGC and Hoya, the two main suppliers of EUV mask blanks, are adding capacity for these critical components that are used for EUV photomasks. A mask blank serves as the substrate for a photomas... » read more

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tag: lithography

Lithography Options For Next-Gen Devices

Lithography Challenges For Leading Edge 3D Packaging Applications

Week In Review: Manufacturing, Test

EUV Arrives, But More Issues Ahead

Manufacturing Bits: March 11

Using Sensor Data To Improve Yield And Uptime

Comparative Stochastic Process Variation Bands For N7, N5, And N3 At EUV

Lithography Challenges For Fan-out

Manufacturing Bits: Feb. 5

EUV Mask Blank Battle Brewing

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