Servers And The Drive to DDR5

By Rambus - 01 Sep, 2021 - Comments: 0

This IDC Technology Spotlight Study, sponsored by Rambus, discusses server demands on DRAM and different workloads. DRAM must dynamically adjust to the needs of these disparate workloads. The history of dynamic random-access memory (DRAM) is characterized by the ability of the technology to adapt to the increasingly specialized real-time memory requirements of the applications that utilize it. ... » read more

How Chips Will Change Health Care

By Ed Sperling - 25 Aug, 2021 - Comments: 0

Jo De Boeck, chief strategy officer and executive vice president at imec, sat down with Semiconductor Engineering to talk about the intersection of medical and semiconductor technology, what's changing in how chips are being used, and what will happen in the short term and long-term. What follows are excerpts of that discussion. SE: Medical technology never advanced at the rate everybody... » read more

Micron B47R 3D CTF CuA NAND Die, World’s First 176L (195T)

By Jeongdong Choe - 19 Aug, 2021 - Comments: 0

Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND is one of the most groundbreaking technologies to date, and it is especially for the storage application such as data center, 5G, AI, cloud, intelligent edge, and mobile devices. Mi... » read more

Time To Rethink Memory Chip Design And Verification

By Anand Thiruvengadam - 12 Aug, 2021 - Comments: 1

It’s no secret to anyone that semiconductor development grows more challenging all the time. Each new process technology node packs more transistors into each die, creating more electrical issues and making heat dissipation harder. Floorplanning, logic synthesis, place and route, timing analysis, electrical analysis, and functional verification stretch electronic design automation (EDA) tools... » read more

Lowering Energy Per Bit

By Ann Mutschler - 12 Aug, 2021 - Comments: 0

Energy is emerging as a focal point in chip and system design, but solving energy-related issues needs to be dealt with on a much broader scale than design teams typically see. Energy is the amount of power consumed over a period of time to perform a given task, but reducing energy is a lot different than reducing power. It affects everything from operational costs and system performance to ... » read more

GDDR6 Memory On The Leading Edge

By Frank Ferro - 12 Aug, 2021 - Comments: 0

With the accelerating growth in data traffic, it is unsurprising that the number of hyperscale data centers keeps rocketing skyward. According to analysts at the Synergy Research Group, in nine months (Q2’20 to Q1’21), 84 new hyperscale data centers came online bringing the total worldwide to 625. Hyperscaler capex set a record $150B over the last four quarters eclipsing the $121B spent in ... » read more

Changes In Auto Architectures

By Ed Sperling - 04 Aug, 2021 - Comments: 0

Automotive architectures are changing from a driver-centric model to one where technology supplements and in some cases replaces the driver. Hans Adlkofer, senior vice president and head of the Automotive Systems Group at Infineon, looks at the different levels of automation in a vehicle, what’s involved in the shift from domain to zonal architectures, why a mix of processors will be required... » read more

Sweeping Changes Ahead For Systems Design

By Ann Mutschler - 29 Jul, 2021 - Comments: 0

Data centers are undergoing a fundamental change, shifting from standard processing models to more data-centric approaches based upon customized hardware, less movement of data, and more pooling of resources. Driven by a flood of web searches, Bitcoin mining, video streaming, data centers are in a race to provide the most efficient and fastest processing possible. But because there are so ma... » read more

Micron D1α, The Most Advanced Node Yet On DRAM

By Jeongdong Choe - 22 Jul, 2021 - Comments: 0

Finally, we got to see D1α DRAM generation! It’s 14nm! After a quick viewing of the Micron D1α die (die markings: Z41C) and its cell design, we have determined its actual technology node (design rule), in contrast to the claims of market literature. It is the most advanced technology node ever on DRAM, and it is the first sub-15nm cell integrated DRAM product. The Micron Z41C die removed... » read more

CXL Memory Interconnect Initiative: Enabling A New Era of Data Center Architecture

By Rambus - 30 Jun, 2021 - Comments: 0

In response to an exponential growth in data, the industry is on the threshold of a groundbreaking architectural shift that will fundamentally change the performance, efficiency and cost of data centers around the globe. Server architecture, which has remained largely unchanged for decades, is taking a revolutionary step forward to address the growing demand for data and the voracious performan... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.