How To More Accurately Predict The Field Reliability Of Automotive Power Electronics


If your company makes planes, trains, automobiles, medical devices, computers, and communication systems, or you are a large electronic device supplier, the reliability of your products in the field is crucial to your business success. The growing market for electric and hybrid vehicles is increasing the pressure on life-time performance of the devices that power them. Estimating the actual fie... » read more

The Trouble With MEMS


The advent of the Internet of Things will open up a slew of new opportunities for MEMS-based sensors, but chipmakers are proceeding cautiously. There are a number of reasons for that restraint. Microelectromechanical systems are difficult to design, manufacture and test, which initially fueled optimism in the MEMS ecosystem that this market would command the same kinds of premiums that analo... » read more

Blog Review: May 25


As a prelude of drone delivery, shipping company DHL set up a carbon fiber tilt-rotor to ferry packages between two villages in the Alps, in this week's top five tech picks from Ansys' Bill Vandermark. Plus, IBM's phase-change memory, see-through wood that's stronger than glass, and perhaps a Babel fish. There have been considerable investments in new memories, but getting to them won't be a... » read more

The Week In Review: IoT


The Internet of Things "doesn't just mean tiny devices," said Charlene Marini, vice president of segment marketing at ARM. "It needs a network." Speaking at the Mentor/ARM Summit in Santa Clara, Calif., this week, she identified several key elements in her presentation, titled “Enabling the Ecosystem for the Backbone of IoT." Among them: Capacity and latency, scalability, agility, infrastruct... » read more

The Week In Review: Design


Acquisitions ARM acquired embedded computer vision and imaging technology company [getentity id="22917" comment="Apical"] for $350 million in cash. According to ARM, the company's technology has been utilized in more than 1.5 billion smartphones and in about 300 million other consumer and industrial devices. Synopsys acquired [getentity id="22916" comment="Simpleware"], a provider of soft... » read more

Pattern Matching in Design and Verification


Pattern matching (PM) was first introduced as the semiconductor industry began to shift from simple one-dimensional rule checks to the two-dimensional checks required by sub-resolution lithography. These rule checks proved far more complex to write, hard to code for fast runtimes, and difficult to debug. Incorporating an automated visual capture and compare process enabled designers to define t... » read more

Assume Nothing: Clearing Up Common Misconceptions About Multi-Patterning


Multi-patterning (MP) makes IC design and manufacture possible at advanced nodes, and Calibre Multi-Patterning technology automates the MP process. However, the complexity of MP and the potential costs of failure require a clear understanding of the process and its limitations. Even though MP has been used for several nodes, there are still some serious disconnects in industry expectations and ... » read more

Bridging the IP Divide


IP reuse enabled greater efficiency in the creation of large, complex SoCs, but even after 20 years there are few tools to bridge the divide between the IP provider and the IP user. The problem is that there is an implicit fuzzy contract describing how the IP should be used, what capabilities it provides, and the extent of the verification that has been performed. IP vendors have been trying to... » read more

Blog Review: May 18


Lead-absorbing bots may be the future of cleaning up polluted industrial wastewater, in this week's top five tech picks from Ansys' Justin Nescott. Plus, the Hyperloop is getting closer, and two years of Curiosity. In his latest podcast, Synopsys' Robert Vamosi chats with Chris Clark about the current automotive security landscape and what gaps exist when it comes to standards. From an ED... » read more

The Evolving Thermal Landscape


Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it's important to ensure that temperatures don't rise high enough to cause reliability problems, adding too much circuitry to control heat can reduce performance and lower energy efficiency. The most common approach to dealing with these issues is thermal simulation, which requir... » read more

← Older posts Newer posts →