Blog Review: Dec. 2

By Jesse Allen - 02 Dec, 2015 - Comments: 0

To celebrate ARM's 25th birthday, Neil Cooper teamed up with the Science Museum in London to feature 25 people or objects that were pivotal to the creation of modern technology. This week: James Clerk Maxwell and Heinrich Hertz. Ansys' Bill Vandermark delves deep into the oceans with energy-storing balloons and up to the sky on a diamond thread in his top technology and engineering articles ... » read more

The Challenge Of Fitting In

By Ann Mutschler - 30 Nov, 2015 - Comments: 0

Connections between players in the semiconductor industry are becoming critical for survival. Whether the focus is a connected car, home automation, health care or the energy grid, each company in each of those markets relies on others to build useful products. There are several forces at work here. One is an emphasis on connecting everything, regardless of whether it is inside a single vert... » read more

The Week In Review: Design/IoT

By Jesse Allen - 27 Nov, 2015 - Comments: 0

NXP received all necessary regulatory approvals for the merger with Freescale, and the sale of its RF Power business to JAC Capital. The company now expects to close the merger on December 7. Synopsys introduced VIP to support the proposed IEEE P802.3bs/D1.0 Ethernet 400G standard. The VIP includes a native SystemVerilog UVM architecture, protocol-aware debug and source code test suites. ... » read more

Blog Review: Nov. 25

By Jesse Allen - 25 Nov, 2015 - Comments: 0

If you've been wanting to dig into deep learning, a new video by Cadence's Chris Rowen discusses the basic principles and how its used to build electronic systems capable of analyzing massive amounts of data, recognize patterns, and extract relevant info. Returning from Productronica, Mentor's Michael Ford discusses the show's booming attendance, the seemingly endless hype around Industry 4.... » read more

Handoff Points Getting Blurry

By Ann Mutschler - 24 Nov, 2015 - Comments: 0

Whether driven by [getkc id="74" comment="Moore's Law"] or just sheer complexity, the way information is passed through the design and test flow is changing. For the past couple of process generations, there has been a concerted push by tool vendors and their customers to run more steps earlier in a flow, sometimes concurrently. While this so-called "shift left" helps to speed up software de... » read more

Hardware Models For Software

By Brian Bailey - 24 Nov, 2015 - Comments: 1

Shift left, while a relatively new term, has become important in all parts of the SoC design flow, but its impacts are wide ranging and many still ill defined. It basically means that tasks have to be started earlier than in the past because more accuracy is required from tasks that are further down in the flow in order to make better predictions. It also implies that more steps are performed c... » read more

A Better Way To Measure Heat

By John Parry - 24 Nov, 2015 - Comments: 0

Are you an engineering manager with budget responsibility, concerned about the thermal performance of your company’s designs or manufactured products? Or, are you a senior engineer who is responsible for the thermal design or characterization of components and systems? In either situation, the results of using the transient thermal testing method would be of benefit to you. The method is non-... » read more

Major Growth For Knowledge Center

By Jesse Allen - 24 Nov, 2015 - Comments: 0

First, we would like to thank everyone who has contributed to the success of the Knowledge Center (KC) this year. Its traffic has increased by about 70% over last year and is now giving some of the editorial channels of Semiconductor Engineering a run for their money. The Knowledge Center has two major components. The first are the companies, standards groups and people that drive our indust... » read more

Defining Sufficient Coverage

By Brian Bailey - 24 Nov, 2015 - Comments: 2

Semiconductor Engineering sat down to discuss the definition of sufficient coverage as a part of verification closure with Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"], Willard Tu, director of embedded segment marketing for [getentity id="22186" comment="ARM"], Larry Vivolo (who at the time of this roundtable was senior director of product marketing for [gete... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?