The Challenge Of Updating Cars

By Ann Mutschler - 08 Oct, 2015 - Comments: 0

News stories about automotive hacking are becoming more common, and so is the concern about how to curb this problem. Security has become a new layer of system design complexity, and it's being taken increasingly seriously in a market that until very recently largely ignored it. That attitude is changing rapidly though, particularly with the advent of autonomous and connected vehicles. Secu... » read more

Looking Back At The IoT?

By Anne Cirkel - 08 Oct, 2015 - Comments: 0

No one can claim the IoT suffers from a lack of attention. A quick search of ProQuest for all mentions of the phrase “Internet of Things” since 2005 turns up 1.5 million results, or more than 400 pieces of content a day. That trumps many other topics, tech-related or otherwise, over the same period of time. For comparison: “smart phone” (478K results), “Apple Computer” (362K results... » read more

Power Management Techniques For Smart Grid Devices

By Mentor, a Siemens Business - 08 Oct, 2015 - Comments: 0

Energy efficiency is a top concern among developers building connected devices for the smart grid. Initially, the application-centric approach to building a device was used. But today, with sophisticated hardware power management features available on most modern processors, this is no longer the case. What’s needed is an OS-level approach that allows developers to take advantage of the full ... » read more

Rolling Out Automotive Security

By Ann Mutschler - 08 Oct, 2015 - Comments: 0

The automotive world has traditionally been a secretive place as automakers made it their mission to hold design plans as close to their vests as possible. With complexity in the automotive design process, that tradition has been changing as automakers work ever more closely with their ecosystem. In one example, Adam Sherer, product management group director for automotive safety in the S... » read more

How Long Will FinFETs Last? (Part 3)

By Ann Mutschler - 07 Oct, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss how long [getkc id="185" kc_name="FinFET"]s will last and where we will we go next with Vassilios Gerousis, Distinguished Engineer at [getentity id="22032" e_name="Cadence"]; Juan Rey, Sr. Director of Engineering for Calibre R&D at [getentity id="22017" e_name="Mentor Graphics"]; Kelvin Low, Senior Director Foundry Marketing at [getentity id="22... » read more

Blog Review: Oct. 7

By Jesse Allen - 07 Oct, 2015 - Comments: 0

Ansys' Sunil Nakum takes a look at backing up the brain and concludes that we would need to keep following Moore's Law for a long time given the current approaches and leave several questions unanswered. There is a battle brewing between high-efficiency LED lighting and vintage-style Edison bulbs. With the latest lighting fad, Mentor's John McMillan asks, is style and nostalgia beating high-... » read more

Gaps Remain For EUV Masks

By Mark LaPedus - 02 Oct, 2015 - Comments: 4

Extreme ultraviolet (EUV) lithography is once again at a critical juncture. The oft-delayed technology is now being targeted for 7nm. But there are still a number of technologies that must come together before EUV is inserted into mass production at that node. First, the EUV source must generate more power. Second, tool uptime must improve. Third, the industry needs better EUV resists. A... » read more

Power Estimation: Early Warning System Or False Alarm?

By Brian Bailey - 02 Oct, 2015 - Comments: 0

Semiconductor Engineering sat down with a large panel of experts to discuss the state of power estimation and to find out if the current levels of accuracy are sufficient to being able to make informed decisions. Panelists included: Leah Schuth, director of technical marketing in the physical design group at [getentity id="22186" comment="ARM"]; Vic Kularni, senior vice president and general ma... » read more

Blog Review: Sept. 30

By Jesse Allen - 30 Sep, 2015 - Comments: 0

In an increasingly networked world, NXP's Lars Reger advocates for a change of perspective: one which places data protection and the security of end customers and users at the heart. Differential power analysis has been on the mind of Rambus' Aharon Etengoff recently as increasing numbers of SIM cards are being cracked, plus some counter measures that can be used. Even wondered about the ... » read more

EDA, IP Numbers Up

By Ed Sperling - 28 Sep, 2015 - Comments: 0

EDA and IP numbers increased another 8.5% in Q2, with all regions but Japan showing positive growth. Total revenue was $1.91 billion for the quarter, up from $1.76 billion in Q2 of 2014. The largest category, computer-aided engineering, was $657.2 million for the quarter, up 9.6% compared with the same period last year. IC physical design was $379.2 million, up 6% year over year, and IP was ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?