MEMS Capacitance Extraction With Calibre xACT-3D Software


The growing use of MEMS in today's complex products requires new approaches to capacitance calculation to ensure companies can meet their time-to-market targets while producing products that meet performance and reliability expectations. Freescale Semiconductor and Mentor Graphics collaborated to demonstrate that Calibre xACT-3D software provides a robust method for extracting node-to-node capa... » read more

Case Studies in P&R Double-Patterning Debug


In my last article, we looked at some case studies of the unique types of issues related to double patterning (DP) that place and route (P&R) and chip finishing engineers have to deal with. I’ve got some more interesting case studies to show you this time. In modern P&R designs, the metal routes on a particular layer are unidirectional (or at least primarily unidirectional). Long p... » read more

Tech Talk: 10nm Patterning


David Abercrombie, advanced physical verification methodology program manager at Mentor Graphics, talks about triple and quadruple patterning after 20/16/14nm and what design teams need to understand to get this right. [youtube vid=7bjutPWakpw] » read more

Blog Review: Aug. 19


Several of this week's top reads from Ansys' Justin Nescott sound like they're straight from the pages of sci-fi novels (and comic books). An MIT project is getting close to creating the Iron Man suit, one company plans to finally build a space elevator, and Los Angeles takes an innovative approach to fighting the California drought: 96 million black plastic balls. Smartphones are so yestery... » read more

Fundamental Shifts In Chip Business


Shifting business models, acquisitions, minority investments and increasing uncertainty are creating fundamental shifts in the semiconductor industry that could redefine who is successful in which markets for years to come. The announcement today that [getentity id="22671" e_name="Rambus"] is developing memory controller chips, expanding its business beyond just creating IP for the memory an... » read more

How Much Security Is Enough?


Semiconductor Engineering sat down to discuss the current state of [getkc id="223" kc_name="security"] and what must be done in the future, with Denis Noël, head of cyber security solutions at [getentity id="22499" e_name="NXP"]; Serge Leef, vice president of new ventures at [getentity id="22017" e_name="Mentor Graphics"]; Andreas Kuehlman, senior vice president and general manager of the soft... » read more

2.5D Creeps Into SoC Designs


A decade ago top chipmakers predicted that the next frontier for SoC architectures would be the z axis, adding a third dimension to improve throughput and performance, reduce congestion around memories, and reduce the amount of energy needed to drive signals. The obvious market for this was applications processors for mobile devices, and the first companies to jump on the stacked die bandwag... » read more

How Long Will FinFETs Last?


Semiconductor Engineering sat down to discuss how long FinFETs will last and where we will we go next with Vassilios Gerousis, Distinguished Engineer at [getentity id="22032" e_name="Cadence"]; Juan Rey, Sr. Director of Engineering for Calibre R&D at [getentity id="22017" e_name="Mentor Graphics"]; Kelvin Low, Senior Director Foundry Marketing at [getentity id="22865" e_name="Samsung"]; and Vic... » read more

Poised For Aspect-Oriented Design?


In 1992, [getperson id=" 11046 " comment="Yoav Hollander"] had the idea to take a software programming discipline called aspect-oriented programming (AOP) and apply it to the verification of hardware. Those concepts were incorporated into the [gettech id="31021" t_name="e"] language and [getentity id="22068" e_name="Verisity"] was formed to commercialize it. Hollander had seen that using obj... » read more

How To Fix Common Power Problems


As the industry moves to ever more advanced technology nodes, managing power has emerged as a primary challenge in modern SoC design. With smaller nodes, the wires become taller and narrower, which increases the resistivity and leads to more pronounced voltage drop effects. Electro-migration effects are also more severe at advanced nodes, causing serious reliability concerns. Both RTL synthesis... » read more

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