tag: packaging

NIWeek Test Talk
By Jeff Dorsch - 12 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down with David Hall, Chief Marketer, Semiconductor, of National Instruments, and Mike Watts, NI’s Senior Solutions Marketer, Semiconductor Test, during NIWeek 2018 in Austin, Texas. “One of the opportunities for National Instruments is that over the last 10 years, we’ve seen larger semiconductor organizations change the way they do testing both for R&... » read more

Packaging Chips For Cars
By Jeff Dorsch - 07 May, 2018 - Comments: 2

As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts need to meet stringent safety standards before they are used inside a vehicle. This is true for all safety-critical applications, but for automotive in particular there are several key reasons w... » read more

KLA-Tencor Buys Orbotech
By Mark LaPedus - 20 Mar, 2018 - Comments: 0

In a move to expand into the process equipment and other new businesses, KLA-Tencor has entered into a definitive agreement to acquire Orbotech for approximately $3.4 billion. With the acquisition of Israel’s Orbotech, KLA-Tencor expands its efforts in the inspection and metrology markets. In addition, KLA-Tencor also enters into some new equipment fronts. Orbotech is involved in three ... » read more

Why Use An Assembly Design Kit And Assembly Design Flow?
By Andy Heinig - 08 Feb, 2018 - Comments: 0

A number of years ago, the packages of electronic systems were only intended to protect the circuit from mechanical stresses and to realize a simple fan-out from the close spacing of connections on the circuit to the larger spacing on the packaging. At the time, there were also only a few different packaging types, all of simple design. Over the years, however, the requirements on packages have... » read more

EDA, IP Sales Up 8%
By Ed Sperling - 15 Jan, 2018 - Comments: 0

The EDA sector continues to exhibit solid growth, increasing 8% to $2.2262 billion in Q3, up from $2.0937 billion in the same period in 2016, according to the most recent stats from the ESD Alliance Market Statistics Service. The four-quarter moving average was up 11.5%, year over year. While all of the numbers were up, two areas showed extraordinary growth. One involved Japan, which showed ... » read more

Toward Self-Driving Cars
By Mark Granger - 18 Dec, 2017 - Comments: 0

The automotive market for semiconductors is shifting into high gear. Right now the average car has about $350 worth of semiconductor content, but that is projected to grow another 50% by 2023 as the overall automotive market for semiconductors grows from $35 billion to $54 billion. This strong growth is being driven by the need to develop what we are calling the ‘connected car.’ The ... » read more

Reliability Of Embedded Wafer-Level BGA For Automotive Radar Applications
By STATS ChipPAC - 11 Dec, 2017 - Comments: 0

With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to ... » read more

Where MEMS Can Boldly Go Now
By Jeff Dorsch - 06 Nov, 2017 - Comments: 1

MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

New Power Concerns At 10/7nm
By Ann Mutschler - 16 Oct, 2017 - Comments: 1

As chip sizes and complexity continues to grow exponentially at 7nm and below, managing power is becoming much more difficult. There are a number of factors that come into play at advanced nodes, including more and different types of processors, more chip-package decisions, and more susceptibility to noise of all sorts due to thinner insulation layers and wires. The result is that engineers ... » read more

Noise Abatement
By Brian Bailey - 12 Oct, 2017 - Comments: 0

[getkc id="285" kc_name="Noise"] is a fact of life. Almost everything we do creates noise as a by-product and quite often what is a signal to one party is noise to another. Noise cannot be eliminated. It must be managed. But is noise becoming a larger issue in chips as the technology nodes get smaller and packaging becomes more complex? For some, the answer is a very strong yes, while for ot... » read more

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