Week In Review: Auto, Security, Pervasive Computing


This was a tough week for cybersecurity. Chinese researchers claim to have figured out a way to crack some of the most advanced security algorithms with only 372 physical qubits, versus millions of qubits as previously theorized. This can be used to both speed up quantum decryption and to create large integers that can withstand future attacks. If it proves out, that approach would significantl... » read more

New Class of Electrically Driven Optical Nonvolatile Memory


A new technical paper titled "Electrical Programmable Multi-Level Non-volatile Photonic Random-Access Memory" was published by researchers at George Washington University, Optelligence, MIT, and the University of Central Florida. Researchers demonstrate "a multi-state electrically-programmed low-loss non-volatile photonic memory based on a broadband transparent phase change material (Ge2Sb2S... » read more

Effect of Different Frequency Scaling Levels on Memory in Regard to Total Power Consumption in Mobile MPSoC


New technical paper titled "CPU-GPU-Memory DVFS for Power-Efficient MPSoC in Mobile Cyber Physical Systems" from researchers at University of Essex, Nosh Technologies, and University of Southampton. Abstract "Most modern mobile cyber-physical systems such as smartphones come equipped with multi-processor systems-on-chip (MPSoCs) with variant computing capacity both to cater to performance r... » read more

Week in Review: IoT, Security, Auto


Internet of Things A dairy barn without any people working in it. An automated greenhouse for produce. Coming soon, little robots that will weed crop fields and look for diseased plants. This is Rivendale Farms, in the countryside west of Pittsburgh, which is 175 acres serving as a beta site for agricultural Internet of Things technology. The small farm has about 150 Jersey cows, each of which... » read more

Tiling Is Critical For eFPGA Users: ArrayLinx Delivers


FPGA chips come in multiple sizes — modular blocks of programmable logic, DSP MACs and RAM are intermixed in different sizes and ratios then stitched together with top-level interconnect, clocking, etc and surrounded by a ring of I/Os like GPIO, SerDes, USB, etc. There is extensive engineering and top-level physical design for each distinct FPGA array and chip. eFPGA is different: Custome... » read more

How To Choose The Right Memory


When it comes to designing memory, there is no such thing as one size fits all. And given the long list of memory types and usage scenarios, system architects must be absolutely clear on the system requirements for their application. A first decision is whether or not to put the memory on the logic die as part of the SoC, or keep it as off-chip memory. "The tradeoff between latency and th... » read more

Tech Talk: Extending DRAM


Bruce Bateman, senior principal engineer at Kilopass, talks about how to extend the life of DRAM and how to work with smaller, denser memory.   Related Stories Executive Insight: Charlie Cheng Kilopass’ CEO talks about how to cut the capacitor in DRAM and why that’s important in the data center. » read more