Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Jan, 2023 - Comments: 0

This was a tough week for cybersecurity. Chinese researchers claim to have figured out a way to crack some of the most advanced security algorithms with only 372 physical qubits, versus millions of qubits as previously theorized. This can be used to both speed up quantum decryption and to create large integers that can withstand future attacks. If it proves out, that approach would significantl... » read more

New Class of Electrically Driven Optical Nonvolatile Memory

By Technical Paper Link - 26 Oct, 2022 - Comments: 0

A new technical paper titled "Electrical Programmable Multi-Level Non-volatile Photonic Random-Access Memory" was published by researchers at George Washington University, Optelligence, MIT, and the University of Central Florida. Researchers demonstrate "a multi-state electrically-programmed low-loss non-volatile photonic memory based on a broadband transparent phase change material (Ge2Sb2S... » read more

Effect of Different Frequency Scaling Levels on Memory in Regard to Total Power Consumption in Mobile MPSoC

By Technical Paper Link - 06 Jun, 2022 - Comments: 0

New technical paper titled "CPU-GPU-Memory DVFS for Power-Efficient MPSoC in Mobile Cyber Physical Systems" from researchers at University of Essex, Nosh Technologies, and University of Southampton. Abstract "Most modern mobile cyber-physical systems such as smartphones come equipped with multi-processor systems-on-chip (MPSoCs) with variant computing capacity both to cater to performance r... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 18 Jan, 2019 - Comments: 0

Internet of Things A dairy barn without any people working in it. An automated greenhouse for produce. Coming soon, little robots that will weed crop fields and look for diseased plants. This is Rivendale Farms, in the countryside west of Pittsburgh, which is 175 acres serving as a beta site for agricultural Internet of Things technology. The small farm has about 150 Jersey cows, each of which... » read more

Tiling Is Critical For eFPGA Users: ArrayLinx Delivers

By Flex Logix - 04 Apr, 2018 - Comments: 0

FPGA chips come in multiple sizes — modular blocks of programmable logic, DSP MACs and RAM are intermixed in different sizes and ratios then stitched together with top-level interconnect, clocking, etc and surrounded by a ring of I/Os like GPIO, SerDes, USB, etc. There is extensive engineering and top-level physical design for each distinct FPGA array and chip. eFPGA is different: Custome... » read more

How To Choose The Right Memory

By Ann Mutschler - 02 Apr, 2018 - Comments: 0

When it comes to designing memory, there is no such thing as one size fits all. And given the long list of memory types and usage scenarios, system architects must be absolutely clear on the system requirements for their application. A first decision is whether or not to put the memory on the logic die as part of the SoC, or keep it as off-chip memory. "The tradeoff between latency and th... » read more

Tech Talk: Extending DRAM

By Ed Sperling - 09 Jan, 2017 - Comments: 0

Bruce Bateman, senior principal engineer at Kilopass, talks about how to extend the life of DRAM and how to work with smaller, denser memory. Related Stories Executive Insight: Charlie Cheng Kilopass’ CEO talks about how to cut the capacitor in DRAM and why that’s important in the data center. » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: RAM

Week In Review: Auto, Security, Pervasive Computing

New Class of Electrically Driven Optical Nonvolatile Memory

Effect of Different Frequency Scaling Levels on Memory in Regard to Total Power Consumption in Mobile MPSoC

Week in Review: IoT, Security, Auto

Tiling Is Critical For eFPGA Users: ArrayLinx Delivers

How To Choose The Right Memory

Tech Talk: Extending DRAM

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