tag: SPICE

Design Optimal ESD Protection With Context-Aware SPICE Simulation
By Neel Natekar - 29 Aug, 2024 - Comments: 0

Electrostatic discharge (ESD) is a major reliability concern for modern ICs. Ensuring the robustness of ICs in an ESD event by providing adequate ESD protection is proving to be a major challenge for IC designers due to factors such as shrinking of the design features, reduction in gate oxide thickness, increase in the contact and interconnect resistance and an increase in the overall design co... » read more

Latency, Interconnects, And Poker
By Ed Sperling - 20 Feb, 2024 - Comments: 0

Semiconductor Engineering sat down with Larry Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, and the winner of this year's Phil Kaufman Award for Pioneering Contributions. What follows are excerpts of that conversation. SE: When did you first get started working in semiconductors — and particularly, EDA? Pileggi: This w... » read more

SRAM-Based IMC For Cryogenic CMOS Using Commercial 5 nm FinFETs
By Technical Paper Link - 27 Sep, 2023 - Comments: 0

A technical paper titled “Cryogenic In-Memory Computing for Quantum Processors Using Commercial 5-nm FinFETs” was published by researchers at University of Stuttgart, Indian Institute of Technology Kanpur, University of California Berkeley, and Technical University of Munich. Abstract: "Cryogenic CMOS circuits that efficiently connect the classical domain with the quantum world are the co... » read more

No Hot Products
By Mike Donnelly - 14 Sep, 2023 - Comments: 0

While marketers strive to launch the next “hot” product, engineers struggle to prevent literally hot products! A recent breakthrough in thermal modeling comes just in time as electronic component manufacturers and their OEM customers increasingly battle thermal design issues. Analog electronic component manufacturers have traditionally provided models in SPICE format so customers can sim... » read more

Electro-Thermal Design Breakthrough
By Siemens EDA - 13 Sep, 2023 - Comments: 0

Electronic component manufacturers have traditionally provided models in SPICE format, so customers can simulate their application circuits and better understand the features, capabilities, and interactions of those parts in the system context. Now, with BCI ROM, a similar and parallel thermal model supply chain can develop. This technology breakthrough arrives at a time of component design-in ... » read more

Artificial Neural Network (ANN)-Based Model To Evaluate The Characteristics of A Nanosheet FET (NSFET)
By Technical Paper Link - 02 Sep, 2022 - Comments: 0

This new technical paper titled "Machine-Learning-Based Compact Modeling for Sub-3-nm-Node Emerging Transistors" was published by researchers at SungKyunKwan University, Korea. Abstract: "In this paper, we present an artificial neural network (ANN)-based compact model to evaluate the characteristics of a nanosheet field-effect transistor (NSFET), which has been highlighted as a next-generat... » read more

The Reliability Of Analog Integrated Circuits And Their Simulation-Aided Verification
By Andre Lange - 19 Jul, 2022 - Comments: 0

Different challenges have to be overcome when designing integrated circuits. Besides schematic and layout design work, verification in view of the non-ideal behavior of circuits and semiconductor technologies in particular is also relevant. The designed circuits have to work at specific operating voltages and within ambient temperature ranges and be robust in terms of process fluctuations ... » read more

Accelerating Circuit Simulation 10x With GPUs
By Samad Parekh - 10 Mar, 2022 - Comments: 0

By Samad Parekh (Synopsys) and Srinivas Kodiyalam (NVIDIA) Many aspects of semiconductor design and verification have an ever-growing “need for speed” that has outpaced the performance improvements available by running on CPUs. Electronic design automation (EDA) companies have responded by creating smarter software algorithms to improve simulation time, sometimes at the expense of relaxe... » read more

Parasitic Characterization Comes To Power Design Simulation
By Don Dingee - 09 Mar, 2022 - Comments: 0

Two power design challenges are taking teams into unfamiliar territory. Wide bandgap (WBG) semiconductors target greater efficiency and density. Stricter EMI compliance regulations now come standard in mission-critical industries. Power design practices are still catching up. Simulation often takes a back seat to respinning hardware prototypes until success. What’s missing that could make sim... » read more

Context-Aware SPICE Simulation Improves The Fidelity Of ESD Analysis
By Neel Natekar - 10 Feb, 2022 - Comments: 0

Electrostatic discharge (ESD) is a major reliability concern for integrated circuit (IC) designs. ESD verification is proving to be a significant challenge at advanced nodes, due to growing IC design complexity and transistor counts. Traditional ESD verification approaches using parasitic extraction followed by SPICE simulation are deficient in providing simulation results in a practical runtim... » read more

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