Where Cryptography Is Headed


Reports began surfacing in October that Chinese researchers used a quantum computer to crack military-grade AES 256-bit encryption. Those reports turned out to be wrong, but that did little to dampen concerns about what would happen if it was true. The looming threat of quantum computers breaking today's encryption, and the stockpiling of encrypted data in preparation for a time when it can ... » read more

Blog Review: Dec. 4


Siemens' Reetika explains how creating and verifying a complete reset tree structure allows designers to trace the flow of reset signals across the design and ensure that every sequential element is tagged correctly within its respective reset domain. Cadence's Durlov Khan suggests DDR5 DIMM Memory Models and Discrete Component Models as part of a flexible approach to validating specific com... » read more

SRAM PUF – The Secure Silicon Fingerprint


For many years, silicon Physical Unclonable Functions (PUFs) have been seen as a promising and innovative security technology making steady progress. Today, Static Random-Access Memory (SRAM)-based PUFs have been deployed in hundreds of millions of devices and offer a mature and viable security component that is achieving widespread adoption in commercial products. They are found in devices ran... » read more

Aging, Complexity, And AI In Analog Design


Experts at the Table: Semiconductor Engineering sat down to discuss abstraction in analog vs. digital, how analog circuits age, the growing role of AI, and why there is so much margin in analog designs, with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal pro... » read more

Successful Design Of Power Management Chips


With an industry as large as semiconductors, there are often surprises lurking in some of the more specialized product categories. Everyone knows that huge chips such as CPUs and GPUs command high prices and that memory chips are ubiquitous. However, the domain of power management integrated circuits (PMICs) is less well known to many observers. PMICs are impressive in terms of their technol... » read more

Top-Down Vs. Bottom-Up Chiplet Design


Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation. The case for chiplets is well understood. They can speed up time to market with consistent results, at whatever process node work... » read more

How AI Is Transforming System Design


Experts At The Table: ChatGPT and other LLMs have attracted most of the attention in recent years, but other forms of AI have long been incorporated into design workflows. The technology has become so common that many designers may not even realize it’s a part of the tools they use every day. But its adoption is spreading deeper into tools and methodologies. Semiconductor Engineering sat down... » read more

HBM Options Increase As AI Demand Soars


High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI accelerators, graphic processing units, and high-performance computing applications continues to explode. HBM inventories are sold out, driven by massive efforts and investments in developing and improving large language models such as ChatGPT. HBM is the memory of ch... » read more

FOPLP Gains Traction in Advanced Semiconductor Packaging


Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher integration densities and cost efficiency. Traditionally, FOPLP has been a go-to solution for cost-sensitive applications in consumer electronics, IoT devices, and mid-tier automotive systems. Its ab... » read more

New Tradeoffs In Leading-Edge Chip Design


Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, memory, sensors — are available? Answering these questions and developing the functional architecture are the first steps in a new design — well before committing it to silicon, said Tim Kogel, senior director of technical product management at Synopsys. Yet eve... » read more

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