tag: test

System-Level Testing
By Astronics - 10 Apr, 2017 - Comments: 0

This white paper on system-level testing for semiconductors. Covering the history and trends of system-level test for semiconductors, this solution brief discusses: The increasing complexities of testing advanced semiconductor integrated devices across a span of applications: automotive, mobile computing, wearables, and more; Semiconductor trends driving necessary shifts in testing method... » read more

12 Important Considerations When Migrating to the Digital Pattern Instrument
By NI - 10 Apr, 2017 - Comments: 0

The PXI Digital Pattern Instrument brings ATE-class digital to the PXI platform through features and programming that are familiar to semiconductor test engineers. Those features not only come through in the hardware of the instrument, they also appear in the NI-Digital Pattern Driver and Digital Pattern Editor. The digital pattern instrument represents an improved experience to previously exis... » read more

How Testing MEMS, Sensors Is Different
By Jeff Dorsch - 10 Apr, 2017 - Comments: 2

When it comes to testing microelectromechanical system devices and sensors, sometimes you have to shake and bake. [getkc id="311" comment="MEMS"] and [getkc id="187" kc_name="sensors"] are physically different from standard ICs. They require a specific type of stimulus to get the required testing results. Most chips only need to have an electrical charge run through them to gauge their pass/... » read more

Biz Talk: ASICs
By Ed Sperling - 27 Mar, 2017 - Comments: 0

eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

Testing For Security
By Ed Sperling - 06 Mar, 2017 - Comments: 0

Ever since the IoT became a household name, people have been strategizing about ways to utilize non-secure devices to mount an attack. The first instances of using electricity to overload a device's circuits, thereby neutralizing existing security features, came to light in some of the earliest car hacking incidents. These are basically side-channel attacks using what amounts to an electroni... » read more

Quality Issues Widen
By Ed Sperling - 06 Mar, 2017 - Comments: 0

As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

2.5D Adds Test Challenges
By Jeff Dorsch - 06 Mar, 2017 - Comments: 0

OSATs and ATE vendors are making progress in determining what works and what doesn't in 2.5D packaging, expanding their knowledge base as this evolves into a mainstream technology. A [getkc id="82" kc_name="2.5D"] package generally includes an ASIC connected to a stack of memory chips—usually high-bandwidth memory—using an [getkc id="204" kc_name="interposer"] or some type of silicon bri... » read more

What Next For OSATs
By Mark LaPedus - 06 Mar, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IC-packaging and business trends with Tien Wu, chief operating officer at Taiwan’s Advanced Semiconductor Engineering ([getentity id="22930" comment="ASE"]), the world’s largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What’s the outlook for the IC industry in 2017? Wu:... » read more

The Path To (Virtually) Zero Defective Parts Per Million
By Synopsys - 22 Feb, 2017 - Comments: 0

Despite thorough wafer and package testing, a small number of defective ICs can make their way into systems. These test "escapes" often return as field failures, increasing costs and eroding profit margins. They can also present a hazard if deployed in safety-critical systems, which is why companies purchasing semiconductors for automotive, medical, or aerospace applications often demand a zero... » read more

Test More Complex For Cars, IoT
By Ann Mutschler - 15 Feb, 2017 - Comments: 0

With increasing focus on safety-critical semiconductors—driven by ADAS, IoT, and security—functional safety concerns are going through the roof. Engineering teams are scrambling to determine how to conduct better in-field or online testing because test no longer can be an afterthought. This has been a common theme across the automotive ecosystem for the past few years, and as the automot... » read more

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