tag: ADAS

IP For Centralized ADAS Domain Controllers
By Synopsys - 12 Sep, 2018 - Comments: 0

A centralized architecture is becoming more popular to integrate the ADAS applications into a centralized ADAS domain controller. A centralized architecture reduces cost, minimizes development of separate software applications and reduces system complexity. As automakers adopt multi-domain controllers with centralized ADAS processors, the required performance and functionality of the ADAS proce... » read more

Cracking The Auto IC Market
By Ann Mutschler - 06 Sep, 2018 - Comments: 0

The market for automotive electronics is booming, and it has set off a global scramble among established chipmakers and startups. What's becoming clear, though, is that not everyone understands just how different automotive is from the mobile market. Mobile is still the highest-volume market for semiconductors, but the growth has flattened. In contrast, the value of the automotive electronic... » read more

Build In Functional Safety Early
By Robert Vamosi - 06 Sep, 2018 - Comments: 0

In the automotive world, recalls for electronics affect about five percent of the vehicles on the road. That means 5 out of every 100 vehicles today have a problem with their electronics. If we want to see more autonomous driving vehicles, that number must be improved. There needs be more robustness in the development process. Making cars safer today is Advanced Driver Assistance System (ADA... » read more

$8.5B For Auto, IoT, Security Startups
By Jeff Dorsch - 08 Aug, 2018 - Comments: 0

Investors infused $4.9 billion into automotive-related startups, nearly $2.5 billion into IoT startups and almost $1.2 billion into cybersecurity startups so far in 2018, according to Semiconductor Engineering’s estimates of private funding in the first six months of 2018. Popular investments included companies using artificial intelligence, big data analytics, blockchain, machine learning... » read more

Not Enough Respect For SoC Interconnect
By K. Charles Janac - 30 Jul, 2018 - Comments: 0

For high-volume system-on-chip (SoC) applications—artificial intelligence (AI), automotive, mobility, solid state drives and more—effective interconnect technology can generate hundreds of millions of dollars in revenue due to smaller chip area, better functionality and faster delivery of SoC platforms. State-of-the-art interconnect technology also allows chip designers to create SoC deriva... » read more

Enabling Integrated ADAS Domain Controllers With Automotive IP
By Ron DiGiuseppe - 17 Jul, 2018 - Comments: 0

Traditionally, the electronic control units (ECUs) for individual Advanced Driver Assistance System (ADAS) applications have been placed throughout the car. The latest automotive architecture will integrate ECUs for multiple ADAS applications into centralized domains to combine multiple ADAS functions. The new class of integrated domain controller ECUs utilize data transferred from the car’s ... » read more

The Impact of AI On Autonomous Vehicles
By Synopsys - 06 Jun, 2018 - Comments: 0

Automotive systems designers initially used traditional embedded-vision algorithms in advanced driver assistance systems (ADAS). One of the key enablers of vehicle autonomy moving forward will be the application of artificial intelligence (AI) techniques, particularly those based upon deep-learning algorithms implemented on multi-layer convolutional neural networks (CNNs). These algorithms show... » read more

Progress And Chaos On Road To Autonomy
By Jeff Dorsch - 03 Jun, 2018 - Comments: 1

Progress in the development of fully autonomous vehicles is incremental and slow, but not for lack of effort. Research and development in self-driving cars is under way all around the globe, from the biggest automotive manufacturers and their Tier 1 suppliers to companies not traditionally involved in the automotive industry. Add to that fleets of startups working on sensor technologies and ... » read more

200mm Fab Crunch
By Mark LaPedus - 21 May, 2018 - Comments: 2

Growing demand for analog, MEMS and RF chips continues to cause acute shortages for both 200mm fab capacity and equipment, and it shows no sign of letting up. Today, 200mm fab capacity is tight with a similar situation projected for the second half of 2018 and perhaps well into 2019. In fact, 2018 will likely represent the third consecutive year that 200mm fab capacity will be tight. The sam... » read more

Early Chip-Package-System Thermal Analysis
By Annapoorna Krishnaswamy - 10 May, 2018 - Comments: 0

Next-generation automotive, HPC and networking applications are pushing the requirements of thermal integrity and reliability, as they need to operate in extreme conditions for extended periods of time. FinFET designs have high dynamic power density, and power directly impacts the thermal signature of the chip. Thermal degradation typically occurs over an extended period of chip operation. ... » read more

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