tag: advanced packaging

EDA Grabs Bigger Slice Of Chip Market
By Brian Bailey - 31 Jan, 2019 - Comments: 0

EDA revenues have been a fairly constant percentage of semiconductor revenues, but that may change in 2019. With new customers creating demand, and some traditional customers shifting focus from advanced nodes, the various branches of the EDA tool industry may be where sticky technical problems are solved. IC manufacturing, packaging and development tools all are finding new ways to handle t... » read more

Low Power At The Edge
By Ed Sperling - 17 Jan, 2019 - Comments: 0

The tech world has come to the realization in recent months that there is far too much data to process everything in the cloud. Now it is starting to come to grips with what that really means for edge and near-edge computing. There still are no rules for where or how that data will be parsed, but there is a growing recognition that some level of pre-processing will be necessary, and that in tur... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Reducing Advanced Packaging Costs
By Ed Sperling - 09 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

EDA, IP Show Strong Growth
By Ed Sperling - 07 Jan, 2019 - Comments: 0

EDA and IP revenue increased 6.7% worldwide in Q3 2018 to $2.44 billion, compared to $2.28 billion in the same period in 2017. The growth was fueled by rising investments in startups in AI and 5G, as well as a stampede of new and existing companies targeting automotive electrification and autonomous vehicles. While startup funding ultimately will run out as these new markets mature and cons... » read more

Top Stories from 2018
By Susan Rambo - 03 Jan, 2019 - Comments: 0

After years of consolidation, the semiconductor industry in 2018 underwent an interesting time of transition and uncertainty. From concerns about scaling limits, aging chips and new architectures, here are most-read stories of 2018. [gallery columns="1" size="full" ids="24134285,24135205,24142311,24137395,24131667,24137111,24131651,24140136,24131128,24133163,24138972,24139330"] » read more

What’s the Right Path For Scaling?
By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

Top Stories For 2018
By Brian Bailey - 20 Dec, 2018 - Comments: 0

Each year, I look back to see what articles people like to read. The first thing that has amazed me each year at Semiconductor Engineering is that what should be a strong bias towards articles published early in the year never seems to play out. The same is true this year. More than half of the top articles were published after July. The second thing that remains constant is that people love... » read more

Security, Scaling and Power
By Ed Sperling - 13 Dec, 2018 - Comments: 0

If anyone has doubts about the slowdown and increasing irrelevance of Moore's Law, Intel's official unveiling of its advanced packaging strategy should leave little doubt. Inertia has ended and the roadmap is being rewritten. Intel's discussion of advanced packaging is nothing new. The company has been public about its intentions for years, and started dropping hints back when Pat Gelsinger ... » read more

Packaging Biz Faces Challenges in 2019
By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

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